M1A3P600-1FG144I

The M1A3P600-1FG144I is a ProASIC3 field programmable gate array (FPGA) in a 144-LBGA surface-mount package, delivering 600,000 system gates and 13,824 logic elements for mid-density FPGA designs. Targeted for industrial applications, it combines nonvolatile flash-based reprogrammability, embedded SRAM, and integrated clocking to support high-density system integration, secure in-system programming, and mixed-voltage I/O requirements.

Key Features

• Core Capacity — 600,000 system gates with 13,824 logic elements to implement complex logic and control functions in a compact FPGA footprint.
• Embedded Memory — Approximately 108 kbits (110,592 bits) of on-chip true dual-port SRAM suitable for FIFOs, buffers, and temporary data storage.
• I/O and Standards — 97 user I/Os; the ProASIC3 family offers bank-selectable I/O voltages and broad single-ended and differential I/O standard support as described in the family datasheet.
• Nonvolatile Flash & Security — Flash-based reprogrammable architecture with on-chip FlashROM and family-level support for in-system programming with AES-based decryption for secure configuration.
• Clocking and Performance — Family-level clock conditioning with integrated PLLs and support for high system performance (family datasheet specifies up to 350 MHz system performance).
• Power Supply — Core voltage specified from 1.425 V to 1.575 V to support low-power core operation.
• Package & Mounting — 144-LBGA (supplier package 144-FPBGA, 13×13) surface-mount package for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial-environment deployments.
• Compliance — RoHS-compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Implement control logic, signal processing, and I/O aggregation in industrial systems that require industrial temperature operation and reliable nonvolatile configuration.
• Embedded Systems with Secure Boot/ISP — Use on-chip Flash and AES-capable in-system programming for secure configuration and firmware management.
• Interface Bridging and I/O Expansion — Leverage 97 user I/Os and family-level mixed-voltage I/O support to bridge buses, aggregate sensors, or implement protocol conversion.
• High-Density System Integration — Replace small ASICs or glue-logic with a single reprogrammable device to reduce BOM and shorten time-to-market for compact systems.

Unique Advantages

• Reprogrammable Nonvolatile Architecture: Flash-based configuration retains programmed design when powered off and enables instant-on operation.
• Secure In-System Programming: Family-level support for AES decryption during ISP protects configuration data and supports secure field updates.
• Integrated Clocking: Multiple clock conditioning blocks with PLLs available in the family enhance timing flexibility for complex designs.
• Compact, SMT-Friendly Package: 144-LBGA (13×13 FPBGA form) provides a small board footprint while supporting a significant logic and I/O complement.
• Industrial Reliability: Rated −40 °C to 100 °C and RoHS-compliant for deployment in industrial environments.

Why Choose M1A3P600-1FG144I?

The M1A3P600-1FG144I provides a balanced combination of logic capacity, embedded memory, secure flash-based configuration, and integrated clocking in a compact industrial-grade package. It is suited to designers who need a reprogrammable, nonvolatile FPGA solution capable of handling mid-density designs with robust I/O and temperature requirements.

Choosing this ProASIC3 device offers predictable power characteristics with a defined core voltage range, on-chip SRAM for data buffering, and family-level features such as secure ISP and PLL-based clock conditioning—delivering scalability and reliability across product development and deployment cycles.

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