M1A3P600-1FG144
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 110592 144-LBGA |
|---|---|
| Quantity | 784 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600-1FG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/Os, 110592-bit RAM, 144-LBGA
The M1A3P600-1FG144 is a ProASIC3 family flash-based FPGA designed for commercial embedded applications that require nonvolatile, reprogrammable logic. It provides 600,000 system gates implemented as 13,824 logic elements with on-chip embedded memory and flexible I/O support in a 144-LBGA surface-mount package.
This device is suited to high-density system integration and in-system programmable designs where low power, instant-on behavior and secure programming are important. Its feature set supports mixed-voltage I/O, AES-based secure ISP, and integrated on-chip flash storage for configuration retention.
Key Features
- Core & Logic 600,000 system gates implemented as 13,824 logic elements for mid-range FPGA integration and glue logic functions.
- Embedded Memory Approximately 110.6 kbits of on-chip RAM to support FIFOs, buffers, and embedded data storage.
- On-Chip Nonvolatile Storage Integrated 1 kbit of FlashROM for user nonvolatile storage and instant-on configuration retention when powered off.
- I/O Capacity & Flexibility 97 user I/Os with support for mixed-voltage operation and bank-selectable I/O voltages to interface with a variety of peripherals and signaling standards.
- Security & In-System Programming Supports AES-based ISP and FlashLock® design features for secure configuration and protected in-system updates.
- Power & Voltage Core supply range of 1.425 V to 1.575 V enabling low-power core operation and compatibility with 1.5 V systems.
- Clocking & Performance Integrated clock conditioning circuitry and PLL-based clock management (as provided in the ProASIC3 family) to support synchronous system designs.
- Package & Mounting 144-LBGA (supplier package: 144-FPBGA 13×13) surface-mount package for compact board integration.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operating temperature for standard commercial applications.
- RoHS Compliant Meets RoHS requirements for lead-free manufacturing and assembly.
Typical Applications
- Embedded Control and Sequencing Implement custom control logic, state machines, and timing-critical sequencing using the device’s logic elements and on-chip memory.
- Interface Aggregation and Glue Logic Bridge and translate between mixed-voltage peripherals and buses using the flexible I/O and bank-selectable voltage support.
- Secure In-System Updates Deploy field-updatable configurations with AES-based ISP and nonvolatile flash configuration storage to maintain secure instant-on behavior.
- Prototyping and Low-Volume Production Use reprogrammable flash technology for rapid iteration, design validation, and lower NRE compared to ASIC alternatives.
Unique Advantages
- Nonvolatile, Instant-On Configuration: Retains programmed design in on-chip flash ROM so systems are configuration-ready immediately after power-up.
- Secure Field Updates: AES-based in-system programming and FlashLock® support protect configuration and enable secure firmware delivery.
- Balanced Integration: Mid-range gate count (600k) and 13,824 logic elements provide a balance of density and cost for many embedded designs.
- Flexible I/O Support: 97 user I/Os with mixed-voltage banking allow direct interfacing to multiple voltage domains and peripheral types.
- Compact, Surface-Mount Package: 144-LBGA (13×13) package enables compact PCB layouts while maintaining ample I/O and routing resources.
- Commercial Grade Reliability: Specified operating temperature range of 0 °C to 85 °C for standard commercial environments and RoHS compliance for manufacturing compatibility.
Why Choose M1A3P600-1FG144?
The M1A3P600-1FG144 provides a practical combination of reprogrammable flash-based nonvolatile configuration, mid-range logic capacity, and flexible I/O in a compact 144-LBGA package. Its integrated FlashROM and AES-based ISP features make it well suited to embedded systems that require secure, field-updatable logic with instant-on behavior.
This part is ideal for designers needing a reliable, reprogrammable solution for control, interfacing, and system integration tasks where commercial temperature operation and low-power core voltage are acceptable. The ProASIC3 family heritage and on-chip features enable scalable designs and simplified BOMs for prototyping through production.
Request a quote or submit an inquiry to get pricing and availability for the M1A3P600-1FG144. Our team can provide lead-time information and volume pricing to support your design and production planning.

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