M1A3P600-1FG144

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 110592 144-LBGA

Quantity 784 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600-1FG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/Os, 110592-bit RAM, 144-LBGA

The M1A3P600-1FG144 is a ProASIC3 family flash-based FPGA designed for commercial embedded applications that require nonvolatile, reprogrammable logic. It provides 600,000 system gates implemented as 13,824 logic elements with on-chip embedded memory and flexible I/O support in a 144-LBGA surface-mount package.

This device is suited to high-density system integration and in-system programmable designs where low power, instant-on behavior and secure programming are important. Its feature set supports mixed-voltage I/O, AES-based secure ISP, and integrated on-chip flash storage for configuration retention.

Key Features

  • Core & Logic 600,000 system gates implemented as 13,824 logic elements for mid-range FPGA integration and glue logic functions.
  • Embedded Memory Approximately 110.6 kbits of on-chip RAM to support FIFOs, buffers, and embedded data storage.
  • On-Chip Nonvolatile Storage Integrated 1 kbit of FlashROM for user nonvolatile storage and instant-on configuration retention when powered off.
  • I/O Capacity & Flexibility 97 user I/Os with support for mixed-voltage operation and bank-selectable I/O voltages to interface with a variety of peripherals and signaling standards.
  • Security & In-System Programming Supports AES-based ISP and FlashLock® design features for secure configuration and protected in-system updates.
  • Power & Voltage Core supply range of 1.425 V to 1.575 V enabling low-power core operation and compatibility with 1.5 V systems.
  • Clocking & Performance Integrated clock conditioning circuitry and PLL-based clock management (as provided in the ProASIC3 family) to support synchronous system designs.
  • Package & Mounting 144-LBGA (supplier package: 144-FPBGA 13×13) surface-mount package for compact board integration.
  • Commercial Temperature Grade Rated for 0 °C to 85 °C operating temperature for standard commercial applications.
  • RoHS Compliant Meets RoHS requirements for lead-free manufacturing and assembly.

Typical Applications

  • Embedded Control and Sequencing Implement custom control logic, state machines, and timing-critical sequencing using the device’s logic elements and on-chip memory.
  • Interface Aggregation and Glue Logic Bridge and translate between mixed-voltage peripherals and buses using the flexible I/O and bank-selectable voltage support.
  • Secure In-System Updates Deploy field-updatable configurations with AES-based ISP and nonvolatile flash configuration storage to maintain secure instant-on behavior.
  • Prototyping and Low-Volume Production Use reprogrammable flash technology for rapid iteration, design validation, and lower NRE compared to ASIC alternatives.

Unique Advantages

  • Nonvolatile, Instant-On Configuration: Retains programmed design in on-chip flash ROM so systems are configuration-ready immediately after power-up.
  • Secure Field Updates: AES-based in-system programming and FlashLock® support protect configuration and enable secure firmware delivery.
  • Balanced Integration: Mid-range gate count (600k) and 13,824 logic elements provide a balance of density and cost for many embedded designs.
  • Flexible I/O Support: 97 user I/Os with mixed-voltage banking allow direct interfacing to multiple voltage domains and peripheral types.
  • Compact, Surface-Mount Package: 144-LBGA (13×13) package enables compact PCB layouts while maintaining ample I/O and routing resources.
  • Commercial Grade Reliability: Specified operating temperature range of 0 °C to 85 °C for standard commercial environments and RoHS compliance for manufacturing compatibility.

Why Choose M1A3P600-1FG144?

The M1A3P600-1FG144 provides a practical combination of reprogrammable flash-based nonvolatile configuration, mid-range logic capacity, and flexible I/O in a compact 144-LBGA package. Its integrated FlashROM and AES-based ISP features make it well suited to embedded systems that require secure, field-updatable logic with instant-on behavior.

This part is ideal for designers needing a reliable, reprogrammable solution for control, interfacing, and system integration tasks where commercial temperature operation and low-power core voltage are acceptable. The ProASIC3 family heritage and on-chip features enable scalable designs and simplified BOMs for prototyping through production.

Request a quote or submit an inquiry to get pricing and availability for the M1A3P600-1FG144. Our team can provide lead-time information and volume pricing to support your design and production planning.

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