M1A3P400-FGG256I

The M1A3P400-FGG256I is a ProASIC3 FPGA in a compact 256-LBGA package, offering a balance of programmable logic, embedded memory, and a high I/O count for space-constrained industrial designs. Built for applications that require nonvolatile, instant-on programmable logic, this device combines 9,216 logic elements with 55,296 bits of on-chip RAM and 178 user I/Os to support complex interfacing and control tasks.

Designed for reliable operation across a wide temperature range and optimized for low-voltage core systems, the M1A3P400-FGG256I targets industrial applications where integration, predictable power rails, and component-level RoHS compliance are required.

Key Features

• Logic Capacity  9,216 logic elements (equivalent to 400,000 gates) for implementing custom logic, state machines, and medium-density processing functions.
• Embedded Memory  55,296 bits of on-chip RAM to support FIFOs, buffering, and local data storage for logic blocks and interfaces.
• I/O Density and Flexibility  178 user I/Os to accommodate multiple interfaces and peripheral connections; series-level I/O features include support for mixed-voltage operation across common I/O standards.
• Power and Core Voltage  Core supply range of 1.425 V to 1.575 V, enabling low-voltage system integration and predictable power budgeting.
• Package and Mounting  256-LBGA (256-FPBGA, 17 × 17 mm footprint) surface-mount package for compact, high-density PCB designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments and temperature-variable deployments.
• Security and In-System Programming (Series Feature)  ProASIC3 family devices support secure in-system programming capabilities (including AES ISP and FlashLock features) to protect programmable content.
• RoHS Compliant  Environmentally compliant manufacturing and materials.

Typical Applications

• Industrial Control  Implement custom control logic, sequencing, and interface bridging in factory automation and process control equipment where robust temperature performance is required.
• Embedded Systems  Provide programmable glue logic, protocol adaptation, and peripheral aggregation in compact embedded platforms using the device’s high I/O count and on-chip RAM.
• Communications and Networking  Handle medium-density packet buffering, protocol conversion, and I/O management for networked instruments and industrial communication nodes.
• Consumer and Portable Devices  Integrate low-power, instant-on programmable logic for product feature control and interface management in space-constrained product designs.

Unique Advantages

• Balanced Logic and Memory: 9,216 logic elements paired with 55,296 bits of RAM provide the right combination of resources for mid-range programmable designs without excessive board area.
• High I/O Count: 178 user I/Os simplify system integration by reducing external multiplexers and glue logic.
• Compact, Industry-Ready Package: 256-LBGA (17 × 17 mm) surface-mount packaging supports dense PCB layouts while meeting industrial temperature requirements.
• Predictable Low-Voltage Core: Core supply specified between 1.425 V and 1.575 V enables straightforward power-supply design and low-power system architectures.
• Nonvolatile, Secure Series Capabilities: ProASIC3 family features such as on-chip nonvolatile configuration and secure ISP protect design IP and simplify field updates.
• RoHS Compliance: Meets environmental material requirements for modern product manufacturing.

Why Choose M1A3P400-FGG256I?

The M1A3P400-FGG256I positions itself as a practical choice for mid-density programmable logic needs where a combination of substantial I/O, solid logic capacity, and embedded memory must fit into a compact, industrial-temperature package. Its defined core voltage range and surface-mount 256-LBGA footprint make it well suited for designers focused on integration, predictable power design, and robust operation.

This device is a fit for engineering teams building industrial automation, embedded controls, or communication endpoint products that require programmable flexibility, on-board RAM for buffering, and a high number of external connections—all while maintaining RoHS compliance and industrial temperature performance.

If you would like pricing, lead-time or a formal quote for M1A3P400-FGG256I, request a quote or contact sales to submit your requirements and receive further purchasing details.