M1A3P400-FG256I

The M1A3P400-FG256I is a ProASIC3-class Field Programmable Gate Array in a 256-ball LBGA package, offered by Microchip Technology. This industrial-grade, surface-mount FPGA provides a balance of logic capacity, I/O density and on-chip memory for embedded and industrial designs.

Designed for applications that require configurable digital logic and flexible I/O, the device delivers 9,216 logic elements, roughly 400,000 equivalent gates, 178 I/O pins and approximately 0.055 Mbits of embedded RAM, while operating across a 1.425 V to 1.575 V core supply and a -40 °C to 100 °C temperature range.

Key Features

• Core Capacity — 9,216 logic elements (reported as 9,216 LABs/CLBs equivalent) supporting up to 400,000 gates for mid-density logic integration.
• Embedded Memory — 55,296 bits of on-chip RAM (approximately 0.055 Mbits) for frame buffering, state storage and small lookup tables.
• I/O Density — 178 available I/O pins to support multiple peripherals, buses and interface requirements in compact designs.
• Package & Mounting — 256-LBGA, supplied in a 256-FPBGA (17 × 17 mm) footprint, optimized for surface-mount assembly.
• Power — Core voltage specified from 1.425 V to 1.575 V to match system power rails and design constraints.
• Temperature & Grade — Industrial-grade device rated for operation from -40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance — Manufacturing status compliant with RoHS requirements.
• ProASIC3/EL Series Technology — Part of the ProASIC3 family, which includes low-power Flash-based technology referenced in the series documentation.

Typical Applications

• Industrial Control — Use for programmable logic, protocol bridging and real-time I/O handling in factory automation and machine control systems.
• Communications Equipment — Suitable for interface adaptation, datapath logic and peripheral management in networking and telecom gear.
• Aerospace & Defense Electronics — Applicable for ruggedized embedded systems and instrumentation that require an industrial temperature range and configurable logic.
• Data Acquisition & Test Systems — Implement signal routing, pre-processing and custom timing logic for measurement and test instrumentation.

Unique Advantages

• Balanced Logic and Memory: 9,216 logic elements combined with 55,296 bits of RAM supports a wide range of mid-density designs without external memory for modest buffer needs.
• High I/O Count: 178 I/O pins enable integration of multiple sensors, transceivers and peripherals directly to the FPGA, reducing external glue logic.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to support deployment in temperature-challenged environments common in industrial and defense applications.
• Compact LBGA Package: The 256-LBGA (256-FPBGA, 17 × 17 mm) provides a space-efficient footprint for dense board layouts while remaining surface-mount friendly.
• Controlled Core Supply: Narrow core voltage range (1.425 V–1.575 V) simplifies power-supply design for consistent logic performance.
• RoHS Compliant Manufacturing: Conforms to RoHS requirements for environmental and regulatory alignment.

Why Choose M1A3P400-FG256I?

The M1A3P400-FG256I positions itself as a practical mid-density FPGA for engineers who need a combination of logic capacity, substantial I/O and compact packaging in an industrial-grade device. Its 9,216 logic elements, substantial I/O count and on-chip RAM are well suited for control, interface and data-path functions where board space and temperature resilience matter.

For teams focused on reliable, configurable hardware that integrates into industrial, communications or defense-oriented platforms, this FPGA provides measurable integration benefits and clear electrical and thermal operating windows to simplify system design and validation.

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