M1A3P400-2PQG208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP |
|---|---|
| Quantity | 358 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of M1A3P400-2PQG208I – ProASIC3 FPGA, 151 I/Os, 208-BFQFP
The M1A3P400-2PQG208I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed as a secure, low-power, single-chip reprogrammable solution. This device integrates on-chip nonvolatile flash-based logic with a substantial I/O count and embedded memory, making it suitable for industrial designs and space-constrained, surface-mount PCB implementations.
Typical use cases include control, interface, and signal-processing roles where a combination of reprogrammability, low core-voltage operation, and industrial temperature range are required. The device delivers a balance of logic density, embedded memory, and mixed-voltage I/O flexibility for embedded and industrial applications.
Key Features
- Logic Density — 9,216 logic elements (LEs) supporting up to 400,000 equivalent system gates, enabling mid-range FPGA designs.
- Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 55 kbits) for FIFOs, state storage, and small buffers.
- I/O Capacity — 151 user I/Os with support for mixed-voltage operation as described for the ProASIC3 family, suitable for multi-voltage system interfacing.
- Nonvolatile, Reprogrammable Flash — Flash-based FPGA architecture provides instant-on capability and retains programmed configuration when powered off (series-level capability).
- Security and In-System Programming — Series features include on-chip AES-based ISP and FlashLock security mechanisms for secure configuration and JTAG-based programming (as described in the ProASIC3 dataset).
- Power and Voltage — Core supply range of 1.425 V to 1.575 V for low-voltage operation; supports surface-mount assembly.
- Package and Mounting — 208-pin BFQFP package (supplier package listed as 208-PQFP, 28 × 28 mm) for compact board designs.
- Industrial Temperature Grade — Rated operating temperature: −40 °C to 100 °C, suitable for a broad range of industrial environments.
- RoHS Compliance — Device is RoHS-compliant for environmental regulatory needs.
Typical Applications
- Industrial Control — Implement deterministic control logic, custom interfaces, and mid-density signal processing within industrial equipment using the device’s industrial temperature rating.
- Embedded Systems — Replace ASSPs or create flexible glue logic and protocol bridges where reprogrammability and on-chip nonvolatile configuration are advantageous.
- Consumer and Portable Electronics — Use the low-voltage core and flash-based instant-on behavior for compact, battery-backed, or space-constrained products.
- Secure Configuration and In-System Updates — Leverage the ProASIC3 series’ AES-based ISP and FlashLock features to protect intellectual property and enable secure field updates.
Unique Advantages
- Nonvolatile Instant-On Operation: Flash-based architecture retains configuration when power is removed, removing the need for external configuration memory.
- Balanced Mid-Range Capacity: 9,216 logic elements and 400,000 equivalent gates provide a practical density for many control, interface, and signal-processing designs.
- Flexible I/O Count and Voltage Support: 151 user I/Os and family-level mixed-voltage support allow direct interfacing with multiple voltage domains on the same board.
- Industrial-Grade Reliability: Rated for −40 °C to 100 °C operation, suitable for demanding environmental conditions common in industrial applications.
- Compact Surface-Mount Packaging: 208-pin BFQFP (208-PQFP, 28 × 28 mm) enables high-density PCB layouts while maintaining a wide I/O complement.
- Regulatory and Environmental Compliance: RoHS-compliant construction supports environmental and regulatory requirements.
Why Choose M1A3P400-2PQG208I?
The M1A3P400-2PQG208I positions itself as a practical, mid-density ProASIC3 FPGA option for engineers seeking a reprogrammable, nonvolatile solution with substantial I/O and embedded memory for industrial and embedded applications. Its low-voltage core supply, industrial temperature rating, and compact 208-pin package make it a strong candidate for designs that require durability, configurability, and board-area efficiency.
Designed to streamline BOM and preserve board space, this device is suited to customers who need a reliable, field-updatable FPGA with security and in-system programming capabilities as described in the ProASIC3 family documentation.
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