M1A3P400-2PQG208I

IC FPGA 151 I/O 208QFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP

Quantity 358 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O151Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9216Number of Logic Elements/Cells9216
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of M1A3P400-2PQG208I – ProASIC3 FPGA, 151 I/Os, 208-BFQFP

The M1A3P400-2PQG208I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed as a secure, low-power, single-chip reprogrammable solution. This device integrates on-chip nonvolatile flash-based logic with a substantial I/O count and embedded memory, making it suitable for industrial designs and space-constrained, surface-mount PCB implementations.

Typical use cases include control, interface, and signal-processing roles where a combination of reprogrammability, low core-voltage operation, and industrial temperature range are required. The device delivers a balance of logic density, embedded memory, and mixed-voltage I/O flexibility for embedded and industrial applications.

Key Features

  • Logic Density — 9,216 logic elements (LEs) supporting up to 400,000 equivalent system gates, enabling mid-range FPGA designs.
  • Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 55 kbits) for FIFOs, state storage, and small buffers.
  • I/O Capacity — 151 user I/Os with support for mixed-voltage operation as described for the ProASIC3 family, suitable for multi-voltage system interfacing.
  • Nonvolatile, Reprogrammable Flash — Flash-based FPGA architecture provides instant-on capability and retains programmed configuration when powered off (series-level capability).
  • Security and In-System Programming — Series features include on-chip AES-based ISP and FlashLock security mechanisms for secure configuration and JTAG-based programming (as described in the ProASIC3 dataset).
  • Power and Voltage — Core supply range of 1.425 V to 1.575 V for low-voltage operation; supports surface-mount assembly.
  • Package and Mounting — 208-pin BFQFP package (supplier package listed as 208-PQFP, 28 × 28 mm) for compact board designs.
  • Industrial Temperature Grade — Rated operating temperature: −40 °C to 100 °C, suitable for a broad range of industrial environments.
  • RoHS Compliance — Device is RoHS-compliant for environmental regulatory needs.

Typical Applications

  • Industrial Control — Implement deterministic control logic, custom interfaces, and mid-density signal processing within industrial equipment using the device’s industrial temperature rating.
  • Embedded Systems — Replace ASSPs or create flexible glue logic and protocol bridges where reprogrammability and on-chip nonvolatile configuration are advantageous.
  • Consumer and Portable Electronics — Use the low-voltage core and flash-based instant-on behavior for compact, battery-backed, or space-constrained products.
  • Secure Configuration and In-System Updates — Leverage the ProASIC3 series’ AES-based ISP and FlashLock features to protect intellectual property and enable secure field updates.

Unique Advantages

  • Nonvolatile Instant-On Operation: Flash-based architecture retains configuration when power is removed, removing the need for external configuration memory.
  • Balanced Mid-Range Capacity: 9,216 logic elements and 400,000 equivalent gates provide a practical density for many control, interface, and signal-processing designs.
  • Flexible I/O Count and Voltage Support: 151 user I/Os and family-level mixed-voltage support allow direct interfacing with multiple voltage domains on the same board.
  • Industrial-Grade Reliability: Rated for −40 °C to 100 °C operation, suitable for demanding environmental conditions common in industrial applications.
  • Compact Surface-Mount Packaging: 208-pin BFQFP (208-PQFP, 28 × 28 mm) enables high-density PCB layouts while maintaining a wide I/O complement.
  • Regulatory and Environmental Compliance: RoHS-compliant construction supports environmental and regulatory requirements.

Why Choose M1A3P400-2PQG208I?

The M1A3P400-2PQG208I positions itself as a practical, mid-density ProASIC3 FPGA option for engineers seeking a reprogrammable, nonvolatile solution with substantial I/O and embedded memory for industrial and embedded applications. Its low-voltage core supply, industrial temperature rating, and compact 208-pin package make it a strong candidate for designs that require durability, configurability, and board-area efficiency.

Designed to streamline BOM and preserve board space, this device is suited to customers who need a reliable, field-updatable FPGA with security and in-system programming capabilities as described in the ProASIC3 family documentation.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3P400-2PQG208I.

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