M1A3P400-FG144I

The M1A3P400-FG144I is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It provides 9,216 logic elements, approximately 0.055 Mbits of embedded memory, and up to 97 I/O in a compact 144-LBGA (144-FPBGA 13×13) package.

Designed for low-power, programmable logic integration, this device supports a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C. It is RoHS compliant and leverages the ProASIC3/EL family technology referenced in the datasheet, including Flash*Freeze and low-power flash configuration characteristics.

Key Features

• Logic Capacity  9,216 logic elements (cells) and approximately 400,000 gates for moderate-density logic integration.
• On-chip Memory  55,296 total RAM bits (approximately 0.055 Mbits) of embedded memory for lookup tables, FIFOs and small buffering tasks.
• I/O Count  Up to 97 user I/O pins to support multiple external interfaces and parallel connectivity.
• Flash-based Configuration  Part of the ProASIC3/EL family with flash configuration technology (datasheet reference to Flash*Freeze and low-power flash FPGA characteristics).
• Power  Nominal core supply range of 1.425 V to 1.575 V for stable core operation.
• Package & Mounting  144-LBGA supplier package (144-FPBGA, 13×13) in a surface-mount form factor to meet compact board designs.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for elevated ambient environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Programmable logic and I/O aggregation in automation systems where extended temperature range and up to 97 I/O are required.
• Communications Equipment  Logic-intensive protocol handling and interface bridging using the device’s 9,216 logic elements and embedded RAM.
• Embedded Systems  Moderate-density custom logic, glue logic and peripheral integration within space-constrained, surface-mount designs.

Unique Advantages

• Moderate-density integration: 9,216 logic elements and ~400,000 gates enable substantial system logic without excessive board-level components.
• Compact package: 144-LBGA (13×13) supplier package supports high I/O count and minimizes PCB footprint for dense designs.
• Flash-based, low-power operation: ProASIC3/EL flash configuration attributes provide non-volatile configuration with low static power characteristics as referenced in the datasheet.
• Industrial temperature support: Rated −40 °C to 100 °C for deployments in demanding ambient conditions.
• Controlled core supply range: Defined 1.425 V–1.575 V supply simplifies power-rail planning and ensures consistent core behavior.
• Standards compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose M1A3P400-FG144I?

The M1A3P400-FG144I positions itself as a compact, flash-configured FPGA for designs that need moderate logic density, ample I/O, and robust temperature capability. Its 9,216 logic elements, embedded RAM and 97 I/O provide a balanced integration point between small CPLDs and larger FPGAs.

Engineers specifying this part will benefit from flash-based non-volatile configuration characteristics referenced in the ProASIC3/EL family datasheet, a tight core supply range for predictable power design, and a small 144-LBGA surface-mount package suitable for space-constrained boards. The device is well suited to industrial and embedded applications where these verified, datasheet-backed attributes are required.

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