M1A3P400-2PQG208

The M1A3P400-2PQG208 is a commercial-grade ProASIC3 flash-based FPGA offering 400,000 system gates and 9,216 logic elements in a 208-pin BFQFP package. Designed as a single-chip, reprogrammable solution, it combines embedded memory and flexible I/O to address cost- and power-sensitive designs where rapid development and in-field updates are important.

With 151 user I/Os, support for mixed I/O voltage domains, and on-chip nonvolatile configuration, this device targets consumer and portable markets as well as general-purpose embedded applications that require compact packaging and low-power operation.

Key Features

• Logic Density — 400,000 system gates and 9,216 logic elements provide mid-range programmable logic capacity for control, glue logic, and moderate-complexity functions.
• Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 55 kbits) to implement FIFOs, small buffers, and state storage within the FPGA fabric.
• I/O Capability — 151 user I/Os with bank-selectable mixed-voltage support (1.5 V, 1.8 V, 2.5 V, 3.3 V as documented for the ProASIC3 series) for flexible interfacing to a range of peripherals and power domains.
• Nonvolatile Flash Configuration — Reprogrammable flash-based configuration retains design when powered off and supports in-system updates.
• Security and In-System Programming — Series-level features include on-chip 128-bit AES decryption for ISP via JTAG (IEEE 1532–compliant) and FlashLock content protection.
• Power and Core Voltage — Core supply specified at 1.425 V to 1.575 V (1.5 V nominal), supporting low-power system designs and 1.5 V–only systems as described for the family.
• Package and Mounting — 208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB layouts.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operating temperature for commercial applications.

Typical Applications

• Consumer & Portable Electronics — Implements control logic, protocol bridging, and power-managed interfaces in compact, battery-powered devices.
• Secure In-System Programmable Designs — Uses on-chip AES ISP and FlashLock to protect firmware and enable secure field updates via JTAG.
• Peripheral and Interface Control — Leverages 151 user I/Os and mixed-voltage operation to interface with sensors, displays, and external memory or comms peripherals.
• Low-Power Embedded Systems — 1.5 V core operation and flash-based instant-on capability support designs where energy efficiency and quick startup are important.

Unique Advantages

• Reprogrammable Nonvolatile Design: Flash configuration retains programmed functionality without external memory and enables field reconfiguration.
• Flexible I/O Integration: 151 user I/Os with bank-selectable voltages simplify system-level interfacing and reduce the need for level-shifters.
• Built-in Security for ISP: On-chip 128-bit AES decryption and FlashLock provide a secure update path and content protection for deployed systems.
• Compact Surface-Mount Packaging: 208-BFQFP (28×28 PQFP) supports compact PCB footprints while offering ample I/O count for many embedded applications.
• Commercial-Grade Reliability: Designed for 0 °C to 85 °C operation and RoHS compliance, suitable for mainstream commercial product lines.

Why Choose M1A3P400-2PQG208?

This ProASIC3 device delivers a balanced combination of programmable logic capacity, embedded memory, and extensive I/O in a single, reprogrammable, flash-based FPGA. Its security features for in-system programming and support for mixed-voltage I/Os make it well suited to commercial embedded designs that require secure updates, flexible interfacing, and low-power operation.

Choose the M1A3P400-2PQG208 for mid-density designs that benefit from nonvolatile configuration, on-chip memory, and a compact 208-pin package—ideal for product lines where time-to-market, reprogrammability, and integration reduce BOM complexity and simplify board design.

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