M1A3P400-2FGG256

The M1A3P400-2FGG256 is a ProASIC3 Field Programmable Gate Array (FPGA) in a 256‑LBGA surface‑mount package. It provides a nonvolatile, reprogrammable logic fabric with a high I/O count and embedded memory, targeted at commercial applications that require compact, low‑power FPGA integration.

Designed for use where performance, integration and power efficiency matter, this device is suitable for consumer and portable applications, and other commercial electronic systems that operate within a 0 °C to 85 °C range.

Key Features

• Logic Capacity – Approximately 9,216 logic elements (9,216 logic cells) and 400,000 system gates to implement medium‑complexity logic and control functions.
• Embedded Memory – Approximately 55,296 bits of on‑chip RAM for FIFOs, small buffers and state storage.
• High I/O Count – 178 user I/Os to support wide peripheral connectivity and multi‑bank interfacing.
• Core Voltage – Specified core supply range of 1.425 V to 1.575 V for consistent power management and integration with 1.5 V system domains.
• Package & Mounting – 256‑LBGA (supplier device package: 256‑FPBGA, 17×17) surface‑mount package for compact board designs.
• Commercial Temperature Grade – Rated for operation from 0 °C to 85 °C for commercial temperature environments.
• RoHS Compliant – Meets RoHS requirements for lead‑free assembly and regulatory compliance.
• ProASIC3 Family Capabilities – Series features include reprogrammable flash-based technology, instant‑on behavior, low power operation and advanced in‑system programming and security options (family level).

Typical Applications

• Portable Consumer Electronics – Compact FPGA integration for control logic, interface bridging and user‑interface management in battery‑powered devices.
• Embedded Control – On‑board implemention of custom control, timing and glue logic in commercial electronics where a high I/O count and embedded RAM are needed.
• Peripheral and Interface Bridging – Aggregating or translating multiple external interfaces using the device’s abundant I/Os and programmable logic.
• Low‑Power System Designs – Applications requiring reprogrammable logic with modest power consumption and instant‑on capability (as provided by the ProASIC3 family).

Unique Advantages

• High Logic Density in a Compact Package: Enables mid‑level programmable integration while maintaining a small 256‑LBGA footprint.
• Large I/O Count: 178 user I/Os simplify board routing and reduce the need for external interface components.
• Embedded RAM: Approximately 55 kbits of on‑chip memory supports FIFOs and buffer functions without external SRAM.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for a wide range of commercial applications.
• RoHS Compliance: Supports lead‑free manufacturing requirements for modern production environments.
• ProASIC3 Series Features: Access to family capabilities such as reprogrammable nonvolatile flash and in‑system programming/security options (series level) for design flexibility.

Why Choose M1A3P400-2FGG256?

The M1A3P400-2FGG256 positions itself as a practical, mid‑density FPGA option for commercial designs that need a balance of logic capacity, embedded memory and a high number of I/Os in a compact LBGA package. Its 1.425–1.575 V core supply, surface‑mount 256‑LBGA footprint and RoHS compliance make it straightforward to integrate into modern PCB assemblies.

This device is well suited to engineering teams seeking a reprogrammable, nonvolatile FPGA platform from the ProASIC3 family for consumer, portable and other commercial products where compact size, power efficiency and flexible I/O are priorities.

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