M1A3P400-2FG256I

The M1A3P400-2FG256I is a ProASIC3 family Field Programmable Gate Array (FPGA) from Microchip Technology. It is a low-power, flash-based FPGA device featuring Flash*Freeze technology and provides a mid-range logic capacity for industrial applications.

With 9,216 logic elements, approximately 0.055 Mbits of embedded memory and 178 I/O pins in a 256-LBGA package, the device targets designs that require configurable digital logic, flexible I/O, and a compact surface-mount footprint.

Key Features

• Core Logic  9,216 logic elements (logic cells) delivering the programmable resources required for custom digital functions.
• Embedded Memory  Approximately 0.055 Mbits (55,296 bits) of on-chip RAM for buffering, FIFOs, and small data storage needs.
• I/O Capacity  178 user I/O pins to support a wide range of external interfaces and signal connections.
• Gate Count  Around 400,000 gates for mapping combinational and sequential logic requirements.
• Low-Power Flash Architecture  Flash-based configuration with Flash*Freeze technology as described in the ProASIC3/EL family documentation for low-power operation.
• Power  Single supply voltage range of 1.425 V to 1.575 V for the core supply.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial ambient conditions.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implement custom control logic, sensor interfacing, and protocol bridging where a robust temperature range and surface-mount package are required.
• Communications Equipment  Use the device for protocol translation, I/O aggregation, and timing-critical glue logic in communications systems.
• Data Acquisition & Processing  Deploy the FPGA for front-end signal conditioning, buffering and preprocessing using embedded RAM and configurable logic.
• Embedded System Integration  Provide custom peripheral interfaces and system glue logic with abundant I/O and mid-range logic density.

Unique Advantages

• Flash-based, low-power architecture: Flash*Freeze technology enables non-volatile configuration and low-power operation consistent with the ProASIC3/EL family documentation.
• Balanced logic and memory resources: 9,216 logic elements together with approximately 0.055 Mbits of embedded RAM provide a practical mix for mid-complexity designs.
• High I/O count in a compact package: 178 I/O pins in a 256-LBGA (256-FPBGA 17×17) form factor minimizes board area while maintaining connectivity.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in industrial environments.
• Precise core supply window: Narrow core voltage range (1.425 V to 1.575 V) supports deterministic power budgeting.
• Surface-mount compatibility and RoHS compliance: Designed for modern PCB assembly processes and regulatory environmental requirements.

Why Choose M1A3P400-2FG256I?

The M1A3P400-2FG256I positions itself as a practical, flash-configurable FPGA option for designs that require mid-range logic capacity, substantial I/O, and low-power operation. Its combination of 9,216 logic elements, approximately 0.055 Mbits of embedded memory, and Flash*Freeze technology makes it suitable for industrial digital logic, protocol bridging, and interface consolidation tasks.

Backed by Microchip Technology’s ProASIC3 family documentation and supplied in a compact 256-LBGA surface-mount package, this device addresses applications where predictable power, a defined core voltage, and a wide operating temperature range are important for long-term deployment.

Request a quote or submit a sales inquiry to purchase M1A3P400-2FG256I and evaluate its fit for your next industrial FPGA design.