M1A3P400-2FG256

The M1A3P400-2FG256 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology offered in a 256-LBGA surface-mount package. It delivers approximately 400,000 gates and 9,216 logic elements with 178 user I/Os and 55,296 bits of on-chip RAM for implementing complex custom logic on compact PCBs.

Designed as part of the ProASIC3 low-power flash FPGA family (series datasheet references Flash*Freeze technology), this commercial-grade device operates at a core supply of 1.425 V to 1.575 V and within a 0 °C to 85 °C temperature range, making it suitable for a wide range of embedded applications requiring non-volatile programmable logic.

Key Features

• Core Logic  Approximately 400,000 gates and 9,216 logic elements provide substantial programmable logic capacity for integration of multiple digital functions.
• On‑chip Memory  Total RAM of 55,296 bits (≈0.055 Mbits) for buffering, state storage, and small data structures.
• I/O Count  178 user I/Os to support a broad set of external interfaces and peripherals.
• Power  Core voltage range specified at 1.425 V to 1.575 V to support low-voltage system designs.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for dense board layouts.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Series Technology  Series-level documentation references Flash*Freeze technology for low-power operation and flash-based non-volatile configuration.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded control and glue logic  Use the 9,216 logic elements and 178 I/Os to implement custom control, interface adaptation, and glue logic in embedded systems.
• Protocol bridging and peripheral aggregation  High I/O count and substantial gate density enable consolidation of protocol converters, bus bridges, and peripheral controllers onto a single device.
• Compact, non‑volatile programmable designs  Flash-based ProASIC3 family characteristics and the 256-LBGA package suit compact PCBs and designs that benefit from retained configuration without external configuration memory.

Unique Advantages

• Significant integration density: 400,000 gates and 9,216 logic elements reduce component count by consolidating functions into a single programmable device.
• Versatile connectivity: 178 I/Os accommodate multiple interfaces and enable flexible board-level partitioning.
• Built-in embedded memory: 55,296 bits of on-chip RAM support local buffering and state machines without external RAM.
• Low-voltage core: Operates within a 1.425 V to 1.575 V supply window for compatibility with modern low-voltage systems.
• Compact surface-mount package: 256-LBGA (256-FPBGA 17×17) enables high-density PCB designs while maintaining robust connectivity.
• RoHS compliant: Conforms to RoHS environmental requirements.

Why Choose M1A3P400-2FG256?

The M1A3P400-2FG256 positions itself where substantial programmable logic, ample I/O, and compact packaging are required. Its combination of roughly 400,000 gates, 9,216 logic elements, and 178 I/Os makes it suitable for designs that need to consolidate multiple discrete functions, manage protocol bridging, or implement sophisticated control logic within a commercial temperature range.

With flash-based ProASIC3-series characteristics and a surface-mount 256-LBGA footprint, this device offers a practical balance of integration, non-volatile programmability, and board-level density for developers and procurement teams targeting embedded and communication-focused designs.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical details for the M1A3P400-2FG256.