M1A3P400-1PQG208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP |
|---|---|
| Quantity | 724 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of M1A3P400-1PQG208I – ProASIC3 FPGA, 151 I/Os, 208-BFQFP
The M1A3P400-1PQG208I is a ProASIC3 field programmable gate array (FPGA) in a 208‑pin BFQFP package optimized for industrial applications. It offers a balance of logic capacity, embedded memory, and flexible I/O to serve control, interface, and custom logic requirements where reprogrammability, low power and robust operating range are important.
Built for surface-mount PCB integration, this device combines 9,216 logic elements with 55,296 bits of on‑chip RAM and 151 user I/Os, making it suitable for mid-density programmable designs that require mixed‑voltage I/O support and secure in-system programming options described in the ProASIC3 family documentation.
Key Features
- Logic Capacity — 9,216 logic elements (versatile resources for glue logic, protocol handling, and custom datapaths).
- On‑Chip Memory — 55,296 bits of total RAM (approximately 0.055 Mbits) for FIFOs, small buffers and state storage.
- I/O Density and Flexibility — 151 user I/Os with support for mixed‑voltage operation (1.5V, 1.8V, 2.5V, 3.3V as outlined in the ProASIC3 family), enabling multiple interface standards and bank‑selectable voltages.
- Power Supply — Core supply specified from 1.425 V to 1.575 V, supporting low‑voltage system integration.
- Security and In‑System Programming — Family datasheet documents support for AES‑based ISP and FlashLock features for secure configuration management.
- Package and Mounting — 208‑BFQFP (208‑PQFP, 28×28 mm footprint) in a surface‑mount form factor for compact board layouts.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- Nonvolatile / Instant‑On Family Attributes — ProASIC3 family characteristics include flash‑based reprogrammable technology with instant‑on behavior and single‑chip solutions (as described in the ProASIC3 family documentation).
Typical Applications
- Industrial Control — Use the device’s 151 I/Os and extended temperature range to implement motor interfaces, sensor aggregation, and machine control logic in industrial systems.
- Protocol Bridging and IO Expansion — Leverage 9,216 logic elements and mixed‑voltage I/O to create custom protocol translators, bridge interfaces, or expand host connectivity.
- Embedded System Glue Logic — Implement power sequencing, peripheral control, and custom timing logic where compact package and surface‑mount mounting are required.
- Secure In‑System Programmable Designs — Integrate secure configuration workflows using the ProASIC3 family’s AES ISP and FlashLock capabilities for protected firmware updates and device provisioning.
Unique Advantages
- Mid‑Density Logic in a Compact Package: 9,216 logic elements and 151 I/Os in a 208‑pin BFQFP provide significant capability while maintaining a small PCB footprint.
- Flexible I/O Voltage Support: Bank‑selectable, mixed‑voltage I/Os enable direct interfacing with multiple logic families and peripherals without level‑translator overhead.
- Industrial Reliability: −40 °C to 100 °C operating range and surface‑mount package support deployment in industrial applications with demanding thermal requirements.
- Secure, Reprogrammable Platform: Family‑level AES ISP and FlashLock features enable secure in‑system updates and protect intellectual property in the field.
- Low‑Voltage Core: Narrow core supply range (1.425 V–1.575 V) supports low‑power system designs and consistent power distribution.
Why Choose M1A3P400-1PQG208I?
The M1A3P400-1PQG208I positions itself as a versatile, reprogrammable FPGA solution for engineers who need a balance of logic density, embedded memory, and a high count of mixed‑voltage I/Os in a compact surface‑mount package. Its industrial temperature rating and secure in‑system programming capabilities make it appropriate for long‑life, field‑deployed systems that require maintainable firmware and protected configurations.
Choose this ProASIC3 device when your design requires mid‑density programmable logic, flexible interfacing, and secure update paths, while retaining compact board placement and industrial operating range.
If you need pricing, availability, or a formal quote for M1A3P400-1PQG208I, submit a request or inquiry and our team will respond with current lead times and ordering information.

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