M1A3P400-2FG144I

The M1A3P400-2FG144I is a Military ProASIC3/EL family flash-based FPGA from Microchip Technology. It delivers reprogrammable logic in a low-power flash architecture with Flash*Freeze technology and is supplied in a compact 144‑LBGA package.

Designed for industrial-grade applications, the device provides a balance of logic capacity, on-chip memory, and I/O density suitable for embedded control, communications, and defense-related systems that require operation across an extended temperature range.

Key Features

• Logic Capacity  Approximately 400,000 gates implemented across 9,216 logic elements for implementing complex digital functions.
• Embedded Memory  Approximately 0.055 Mbits of on-chip RAM (55,296 bits) for buffering, state storage, and small data tables.
• I/O  97 user I/O pins to interface with peripherals, sensors, and external logic.
• Package & Mounting  144‑LBGA surface-mount package (supplier device package: 144‑FPBGA, 13×13) for compact board designs.
• Power  Core supply range of 1.425 V to 1.575 V to match system power rails and enable controlled power sequencing.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Low-Power Flash Architecture  Part of the ProASIC3/EL family of low-power flash FPGAs featuring Flash*Freeze technology for reduced power states and nonvolatile configuration.
• Compliance  RoHS compliant for global environmental requirements.

Typical Applications

• Industrial Control and Automation  I/O-rich, industrial-grade FPGA suitable for motor control, PLCs, and factory automation where extended temperature operation and logic integration are required.
• Aerospace & Defense Systems  Military-series ProASIC3/EL architecture supports defense and aerospace subsystems that benefit from flash-based nonvolatile configuration and low-power modes.
• Communications and Networking  Useful for protocol handling, interface bridging, and small-scale packet processing tasks where mid-range logic density and multiple I/Os are needed.
• Embedded Prototyping and Custom Logic  A compact LBGA package and substantial logic resources make the device suitable for embedded system prototypes and custom logic acceleration.

Unique Advantages

• Flash-based, low-power architecture: Flash configuration and Flash*Freeze technology provide nonvolatile configuration with lower active and standby power than volatile-only FPGAs.
• Balanced logic and memory: 9,216 logic elements paired with 55,296 bits of embedded RAM delivers a practical mix for medium-complexity designs without external memory.
• Extended temperature operation: Industrial operating range (−40 °C to 100 °C) supports deployment in harsh or outdoor environments.
• Compact system footprint: 144‑LBGA (144‑FPBGA 13×13) surface-mount package enables space-constrained board layouts while retaining robust I/O count.
• Deterministic supply requirements: Tight core voltage range (1.425–1.575 V) simplifies power budgeting and voltage regulation design.
• Standards-friendly sourcing: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose M1A3P400-2FG144I?

The M1A3P400-2FG144I occupies a practical position for designers needing a mid-density, flash-configured FPGA with industrial temperature capability. Its combination of roughly 400K gates, 9,216 logic elements, and 97 I/Os provides designers with the resources to implement custom control logic, interface bridging, and protocol handling without adding discrete configuration memory.

With a compact 144‑LBGA package, RoHS compliance, and a defined core voltage and temperature window, this device offers predictable electrical and mechanical integration for embedded and defense-oriented projects that require nonvolatile configuration and lower-power operation.

Request a quote or submit an inquiry to receive pricing and availability for the M1A3P400-2FG144I. Our team can provide procurement details and help assess fit for your design requirements.