M1A3P400-FGG256

The M1A3P400-FGG256 is a ProASIC3 series flash-based, reprogrammable, nonvolatile Field Programmable Gate Array (FPGA) from Microchip Technology. This single-chip FPGA integrates 400,000 system gates and 9,216 logic elements to support complex glue logic, control functions, and hardware acceleration in compact, low-power systems.

Designed for commercial-temperature applications, the device targets portable and consumer designs, battery-backed systems, and applications that benefit from instant-on behavior, low power consumption, and in-system programmability with built-in security.

Key Features

• Core density – 400,000 system gates and 9,216 logic elements provide substantial programmable logic capacity for mid-density designs.
• Embedded memory – Approximately 55 kbits of on-chip RAM (55,296 bits) for embedded data storage, FIFOs, and small buffering tasks.
• I/O capacity and flexibility – 178 user I/Os to support wide connectivity; the ProASIC 3 family provides bank-selectable, mixed-voltage I/O operation across common single-ended standards.
• Nonvolatile flash-based architecture – Reprogrammable flash technology retains the programmed design when powered off and supports instant-on operation.
• Security and in-system programming – Series-level features include on-chip AES decryption for secure ISP and FlashLock for device content protection.
• Performance and low power – Flash-based ProASIC 3 devices are described as low-power with instant-on capability; the series supports high system performance.
• Power supply – Core voltage supply range 1.425 V to 1.575 V (1.5 V nominal).
• Package and mounting – 256-LBGA package (supplier device package 256-FPBGA, 17 × 17) with surface-mount mounting for compact board integration.
• Commercial temperature grade – Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Portable consumer devices – Use the M1A3P400-FGG256 for compact, low-power control and interface functions in handheld and battery-powered products.
• Battery-backed systems – Nonvolatile flash and instant-on behavior make it suitable for systems that require quick startup and retention of programmed logic when power is removed.
• Security-sensitive designs – On-chip AES-based in-system programming and FlashLock features support secure firmware loading and protection of the FPGA bitstream.
• ASIC/ASSP replacement and prototyping – The reprogrammable ProASIC3 architecture offers a single-chip alternative for accelerating time-to-market and iterating hardware designs.

Unique Advantages

• Highly integrated mid-density FPGA: 400,000 system gates and 9,216 logic elements consolidate logic and control functions into a single device, reducing board complexity.
• Nonvolatile instant-on operation: Flash-based configuration retains the programmed design without external configuration memory and enables immediate startup.
• Secure in-field updates: Series-level AES-based ISP and FlashLock support secure programming and protection of intellectual property.
• Flexible I/O and mixed-voltage support: Bank-selectable I/O voltages and a large number of user I/Os simplify interfacing to a variety of peripherals and standards.
• Compact surface-mount package: 256-LBGA (17 × 17) packaging provides a small footprint for space-constrained designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for typical commercial applications.

Why Choose M1A3P400-FGG256?

The M1A3P400-FGG256 delivers a balanced combination of programmable logic density, embedded memory, and a large I/O count in a nonvolatile, flash-based FPGA. Its 1.5 V core supply range, RoHS compliance, and surface-mount 256-LBGA package make it well suited for commercial designs where instant-on, secure in-system programming, and compact integration are priorities.

For engineering teams seeking a single-chip, reprogrammable alternative to ASICs or ASSPs with scalability across the ProASIC 3 family, this part offers a practical path to reduce BOM complexity while maintaining on-board flexibility.

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