M1A3P400-1FGG256

The M1A3P400-1FGG256 is a ProASIC®3 flash-based FPGA offering a reprogrammable, nonvolatile single-chip solution optimized for low-power, secure, and instant-on applications. Built on the ProASIC 3 nano family architecture, this device provides 9,216 logic elements, approximately 400,000 system gates and 55,296 bits of on-chip RAM for compact, flexible digital designs.

Targeted at commercial consumer and portable markets where performance, cost and time-to-market matter, the device supports mixed-voltage I/O, in-system programming with AES security, and a compact 256-LBGA (17×17) surface-mount package for space-constrained designs.

Key Features

• Logic Capacity — 9,216 logic elements (9216 LEs) and approximately 400,000 equivalent system gates provide capacity for mid-density logic integration.
• Embedded Memory — Total on-chip RAM of 55,296 bits suitable for small SRAM/FIFO structures and state storage within the FPGA fabric.
• I/O and Voltage Support — 178 user I/Os with support for mixed-voltage operation across banks (1.5V, 1.8V, 2.5V and 3.3V signaling options noted in the ProASIC 3 nano series).
• Nonvolatile Flash Technology — Reprogrammable flash-based CMOS process with instant-on capability and on-chip FlashROM for user nonvolatile storage as described in the ProASIC 3 nano series.
• Security and In-System Programming — Series-level support for on-chip AES decryption via JTAG for secure ISP and FlashLock® protection mechanisms (as described for ProASIC 3 nano devices).
• Low-Voltage Core — Core supply range of 1.425 V to 1.575 V for low-power operation.
• Compact Package — 256-LBGA (17×17) surface-mount package enabling high pin-count in a compact footprint; RoHS-compliant.
• Commercial Temperature Rating — Operating temperature range of 0 °C to 85 °C, suitable for commercial applications.

Typical Applications

• Portable Consumer Electronics — Low-power core voltage and instant-on flash architecture make the device suitable for battery-backed and portable systems requiring reprogrammable logic.
• Secure Embedded Systems — On-chip AES-based ISP and FlashLock® support secure configuration updates and IP protection within embedded products.
• Mixed-Voltage Interface Control — Bank-selectable I/O voltages and a high I/O count enable interfacing between different voltage domains and multiple peripherals.

Unique Advantages

• Reprogrammable Nonvolatile Design — Flash-based configuration retains programmed designs when powered off, simplifying field updates and reducing external configuration components.
• Integrated Security for ISP — On-chip AES decryption via JTAG and FlashLock® mechanisms provide series-level secure in-system programming and content protection.
• Balanced Logic and Memory — 9,216 logic elements paired with 55,296 bits of embedded RAM gives designers the ability to implement control logic with modest embedded data storage on a single device.
• Compact, High-Pin Package — 256-LBGA (17×17) package delivers a high I/O count (178) in a small footprint for space-constrained PCBs.
• Low-Power Core Supply — 1.425 V to 1.575 V core operation reduces power consumption for designs targeting energy-sensitive applications.
• RoHS-Compliant — Conforms to RoHS requirements for environmentally conscious manufacturing and supply chains.

Why Choose M1A3P400-1FGG256?

The M1A3P400-1FGG256 positions itself as a versatile mid-density flash FPGA that combines reprogrammability, on-chip nonvolatile storage, and security-focused in-system programming. Its 9,216 logic elements, substantial I/O count, and embedded RAM make it suitable for compact commercial applications where instant-on behavior and protected configuration matter.

For design teams seeking a single-chip approach that reduces external configuration components and supports secure field updates, this ProASIC3 device delivers a balanced mix of logic capacity, mixed-voltage I/O flexibility, and a space-efficient 256-LBGA package backed by RoHS compliance.

Request a quote or submit a sales inquiry to evaluate M1A3P400-1FGG256 for your next design and to discuss volume pricing and availability.