M1A3P400-1FG256

The M1A3P400-1FG256 is a ProASIC3 flash-based FPGA from Microchip Technology offered in a 256-LBGA package. It integrates 9,216 logic elements and approximately 55,296 bits of on-chip RAM to implement custom digital logic, interface bridging, and control functions for commercial embedded systems.

This device provides a balanced combination of logic density, I/O count and low-voltage operation (1.425 V to 1.575 V) suited to communications, data and industrial-class designs that require reprogrammable logic in a compact surface-mount package. The device is RoHS compliant and rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity — 9,216 logic elements (cells) supporting up to 400,000 gates for implementing mid-density digital designs and glue logic.
• Embedded Memory — Approximately 0.055 Mbits (55,296 bits) of on-chip RAM for buffering, FIFOs and small data structures.
• I/O Resources — 178 available I/O pins to support multiple parallel interfaces and mixed-signal front-ends.
• Package and Mounting — 256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Supply Voltage — Operates from 1.425 V to 1.575 V, enabling integration with low-voltage system rails.
• Operating Grade — Commercial temperature range specified from 0 °C to 85 °C.
• Flash-based Architecture — Part of the ProASIC3 family with documented Flash*Freeze technology at the series level (flash-based configuration documented in the ProASIC3/EL datasheet).
• Regulatory — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Communications Equipment — Implement protocol bridging, packet pre-processing, and I/O adaptation using the device’s logic density and abundant I/O.
• Industrial Control — Deploy for machine control, sensor interfacing, and deterministic logic tasks within commercial-temperature industrial systems.
• Embedded Systems — Use as glue logic, custom peripheral controllers, or interface concentrators in compact, surface-mount designs.

Unique Advantages

• High Logic Density: 9,216 logic elements and 400,000 gates provide the capacity to implement complex finite-state machines and custom datapaths without external ASICs.
• Generous I/O Count: 178 I/O pins enable direct connection to multiple peripherals and parallel interfaces, reducing the need for external multiplexers or bridges.
• Compact, Manufacturable Package: The 256-LBGA (17×17) surface-mount footprint balances board space and pin count for compact system designs.
• Low-Voltage Operation: Supported supply range of 1.425 V to 1.575 V aligns with modern low-voltage system rails for power-efficient designs.
• RoHS Compliance: Meets lead-free manufacturing requirements for commercial production environments.
• Series-Level Flash Configuration: ProASIC3 family flash-based configuration (Flash*Freeze technology documented in the datasheet) supports non-volatile programming behavior at the family level.

Why Choose M1A3P400-1FG256?

The M1A3P400-1FG256 occupies a valuable position for designers seeking a mid-density, flash-based FPGA with substantial I/O and compact packaging. Its combination of 9,216 logic elements, 178 I/Os and on-chip RAM makes it suitable for embedded and communications-oriented designs that need reprogrammable logic without large board-level overhead.

With commercial temperature grading, RoHS compliance and a low-voltage supply range, this device delivers a pragmatic balance of integration, manufacturability and predictable electrical characteristics for production systems that leverage the ProASIC3 architecture.

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