M1A3P400-1FG144I

The M1A3P400-1FG144I is a ProASIC3 family flash-based FPGA from Microchip Technology designed for programmable digital logic integration. It delivers 9,216 logic elements and approximately 400,000 gates with 55,296 bits of on-chip RAM to support a broad range of custom logic and interface functions.

Targeted at industrial applications and commercial embedded systems, this surface-mount device combines a compact 144-LBGA package with a 97-pin I/O count and a narrow supply voltage range for consistent, low-voltage operation across a −40 °C to 100 °C operating range.

Key Features

• Logic Capacity — 9,216 logic elements (9216 logic elements) and approximately 400,000 gates provide the silicon resources for complex custom logic and glue-logic implementations.
• On‑Chip Memory — 55,296 bits of embedded RAM for local buffering, state storage, and small data structures inside the FPGA design.
• I/O Count — 97 user I/O pins to support parallel interfaces, GPIO expansion, and mixed signal domain connections.
• Flash‑Based Architecture — Part of the ProASIC3 family with Flash*Freeze technology referenced in the device family documentation, providing nonvolatile configuration storage at power-up.
• Power and Voltage — Operates from a core supply of 1.425 V to 1.575 V for stable low-voltage core operation.
• Package and Mounting — 144‑LBGA (supplier package: 144‑FPBGA, 13 × 13 mm) in a surface-mount form factor to save PCB area while enabling high-density integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Industrial Control — Implement custom state machines, I/O expansion, and deterministic control logic in factory automation and process control systems.
• Communications Equipment — Provide protocol glue logic, parallel interface handling, and custom datapath functions in telecom and network hardware.
• Aerospace & Defense Systems — Deploy configurable logic resources for mission-specific signal processing and control within the broader aerospace and defense market segments referenced in the device family documentation.
• Data Center and Enterprise Infrastructure — Use programmable logic for system management, custom interfacing, and hardware acceleration tasks in rack‑mount and appliance platforms.

Unique Advantages

• Compact BGA Packaging: 144‑LBGA (13 × 13 mm) saves PCB area while delivering substantial logic and I/O capability.
• High Integration Density: 9,216 logic elements and ~400,000 gates enable consolidation of multiple discrete functions into a single device, simplifying board-level design.
• On‑Chip Memory: 55,296 bits of embedded RAM reduce dependence on external memory for small buffers and state storage.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and offered in a surface-mount package suitable for industrial system designs.
• Low‑Voltage Core: Narrow core supply range (1.425 V–1.575 V) supports consistent, controlled power delivery for the FPGA core.
• Environmental Compliance: RoHS compliance supports deployments where lead‑free and restricted substance requirements apply.

Why Choose M1A3P400-1FG144I?

The M1A3P400-1FG144I positions itself as a practical, flash-based programmable logic option for designers needing moderate logic density, a measurable on-chip RAM footprint, and a healthy I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived commercial and industrial applications where stable operation across a wide temperature range is required.

Engineering teams seeking to reduce board-level complexity while maintaining field-programmability and nonvolatile configuration storage will find the combination of logic resources, I/O, and package geometry useful for consolidating functions and simplifying system architectures.

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