M1A3P400-1FG144

The M1A3P400-1FG144 is a ProASIC3 field-programmable gate array (FPGA) IC from Microchip Technology. It delivers a moderate-density flash-based FPGA architecture with on-chip memory and a 97-pin I/O count in a compact 144-LBGA surface-mount package.

Targeted for commercial embedded designs, the device provides a balance of logic capacity, embedded RAM and a precise core supply range, making it suitable for applications that require configurable logic, I/O interfacing and compact board-level integration.

Key Features

• Core Logic — Approximately 9,216 logic elements (reported as 9,216 LABs/CLBs equivalent) supporting up to 400,000 gates for mid-density programmable logic functions.
• Embedded Memory — Approximately 55,296 bits of on-chip RAM to implement FIFOs, small buffers and state storage without external memory.
• I/O — 97 general-purpose I/O pins to support multiple peripheral interfaces and signal routing on a single device.
• Power and Voltage — Core voltage supply range of 1.425 V to 1.575 V, enabling predictable power budgeting for core circuitry.
• Package and Mounting — 144-LBGA package (supplier device package: 144-FPBGA, 13 × 13 mm) in a surface-mount form factor for compact PCB layouts.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS-compliant material status for environmental regulatory alignment.
• Family Technology — Part of the ProASIC3 family; family-level documentation references Flash*Freeze technology for flash-based FPGA implementations.

Typical Applications

• Embedded control systems — Use the device’s 9,216 logic elements and on-chip RAM to implement custom control state machines and signal processing logic within commercial embedded products.
• Interface bridging and glue logic — 97 I/Os allow consolidation of interface translation, bus arbitration and signal conditioning tasks on a single FPGA.
• Compact board-level integration — The 144-LBGA surface-mount package facilitates dense PCB designs where board area and I/O routing are constrained.

Unique Advantages

• Balanced logic density: Approximately 9,216 logic elements and ~400,000 gates provide substantial capacity for mid-range programmable logic functions without requiring a larger device footprint.
• On-chip RAM reduces external BOM: About 55,296 bits of embedded memory reduce the need for small external SRAM components for buffering and state retention.
• Ample I/O for system integration: 97 I/Os enable consolidation of multiple peripheral interfaces and simplify board-level routing.
• Compact LBGA package: 144-LBGA (144-FPBGA, 13 × 13 mm) offers a small, manufacturable form factor for space-constrained designs.
• Predictable power requirements: Narrow core voltage window (1.425 V–1.575 V) assists in power-supply selection and system-level power planning.
• Commercial-grade operating range: Rated for 0 °C to 85 °C for designs intended for commercial environments.

Why Choose M1A3P400-1FG144?

The M1A3P400-1FG144 positions itself as a commercial-grade, mid-density ProASIC3 FPGA option that combines nearly 9,216 logic elements, on-chip RAM and a 97-pin I/O complement in a compact 144-LBGA package. Its flash-based family technology and clearly specified electrical and thermal limits make it a practical choice for engineers seeking configurable logic for embedded control, interface consolidation and compact system integration.

For designs that require a balance of logic capacity, integrated RAM and a small package footprint under commercial temperature and voltage specifications, the M1A3P400-1FG144 offers a verifiable hardware platform drawn from the ProASIC3 family documentation.

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