M1A3P400-1FGG144

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 55296 144-LBGA

Quantity 81 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9216Number of Logic Elements/Cells9216
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of M1A3P400-1FGG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/Os, 55,296 bits RAM, 144‑LBGA

The M1A3P400-1FGG144 from Microchip Technology is a ProASIC3 family flash-based FPGA in a 144‑pin LBGA package. It delivers a compact, reprogrammable, single‑chip FPGA solution with 9,216 logic elements (approximately 400k equivalent system gates) and 55,296 bits of embedded RAM, aimed at commercial applications requiring low-power, secure, and instant-on programmable logic.

Designed for surface-mount assembly and commercial temperature operation (0 °C to 85 °C), this device suits space-constrained boards that require mixed-voltage I/O flexibility and on-chip nonvolatile configuration from flash technology.

Key Features

  • Logic Capacity — 9,216 logic elements (9216 logic elements) providing the equivalent of approximately 400,000 system gates for mid-density logic integration.
  • Embedded Memory — 55,296 bits of on-chip RAM for FIFOs, state storage, and buffering in user designs.
  • I/O and Voltage Flexibility — 97 user I/Os with series support for mixed-voltage operation across I/O banks (1.5 V, 1.8 V, 2.5 V, and 3.3 V supported by the ProASIC3 family).
  • Nonvolatile, Flash-Based Architecture — Reprogrammable flash technology and single-chip instant-on capability as described for the ProASIC3 series, retaining configuration when powered off.
  • Security and In-System Programming — Series-level support for in-system programming (ISP) with on-chip 128‑bit AES decryption via JTAG (IEEE 1532–compliant) and FlashLock® for design protection.
  • Power and Core Voltage — Low-voltage core operation with a documented supply range of 1.425 V to 1.575 V suitable for low‑power system designs.
  • Package and Mounting — 144‑LBGA package (144-FPBGA, 13×13 footprint) for a compact board footprint; surface-mount mounting type.
  • Commercial Grade and Compliance — Commercial grade device with operating temperature range 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Portable and Battery-Powered Devices — Low-voltage core and flash-based instant-on capability make this device suitable for compact, power-sensitive systems.
  • Consumer Electronics — Mid-density programmable logic for glue logic, protocol bridging, and user-interface control in consumer products.
  • Secure In-System Programmable Designs — On-chip AES decryption and FlashLock® help protect configuration data for systems that require secure field updates.
  • Mixed-Voltage I/O Systems — Bank-selectable I/O voltage support from the ProASIC3 family enables interfacing across 1.5 V to 3.3 V domains without external level translators in many cases.

Unique Advantages

  • Balanced Logic and Memory — 9,216 logic elements paired with 55,296 bits of embedded RAM provide a practical midpoint between low- and high-density FPGA options for streamlined designs.
  • Nonvolatile Configuration — Flash-based architecture retains programmed designs without external configuration memory, simplifying BOM and board design.
  • Compact Package — 144‑LBGA (13×13) footprint supports high-density board layouts while retaining nearly 100 user I/Os.
  • Security-Ready ISP — Series-level AES ISP and FlashLock® capabilities enable protected field programming and design security for deployed devices.
  • Low-Voltage Core Compatibility — Core supply range centered around 1.5 V supports low-power system architectures and integration with modern low-voltage supplies.
  • Regulatory and Assembly Friendly — RoHS-compliant and surface-mount package format for modern manufacturing processes.

Why Choose M1A3P400-1FGG144?

The M1A3P400-1FGG144 combines a mid-range logic element count with on-chip embedded RAM and flash-based nonvolatile configuration in a compact 144‑LBGA package from Microchip Technology. It is positioned for commercial designs that require reprogrammable logic, secure in-system programming, and low-voltage operation while keeping board space and component count minimal.

This device is a practical choice for engineers developing portable consumer systems, mixed-voltage interfaces, and secure field-update workflows who need a balance of logic capacity, embedded memory, and package density with commercial temperature operation and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability to evaluate M1A3P400-1FGG144 for your next design. Provide your quantity and shipping requirements to receive a prompt response.

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