M1A3P250-PQG208
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 36864 208-BFQFP |
|---|---|
| Quantity | 1,073 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of M1A3P250-PQG208 – ProASIC3 FPGA, 250k Gates, 208-BFQFP
The M1A3P250-PQG208 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 250,000 gates of programmable logic arranged as 6,144 logic elements and includes on-chip embedded memory and a broad I/O count for integration into compact electronic designs. With a low-voltage supply range and a 208-pin BFQFP package, this commercial-grade FPGA targets applications requiring moderate logic capacity, dense I/O, and surface-mount packaging.
Key Features
- Core Logic 250,000 gates organized as 6,144 logic elements for implementing medium-complexity FPGA designs.
- Embedded Memory Approximately 0.037 Mbits (36,864 bits) of on-chip RAM to support data buffering and small lookup tables.
- I/O Density 151 user I/O pins to accommodate a wide range of external interfaces and signal routing requirements.
- Power Operates from a nominal supply range of 1.425 V to 1.575 V to match low-voltage system domains.
- Package & Mounting Supplied in a 208-BFQFP package (supplier package: 208-PQFP, 28 × 28 mm) optimized for surface-mount assembly.
- Operating Range & Grade Commercial temperature range 0 °C to 85 °C and designated as commercial grade for standard embedded applications.
- Regulatory Compliance RoHS compliant to support environmentally conscious product builds.
Unique Advantages
- Highly integrated logic capacity: 250,000 gates and 6,144 logic elements enable consolidation of multiple discrete functions into a single device, reducing board-level complexity.
- On-chip memory for compact designs: Approximately 0.037 Mbits of embedded RAM supports local data storage needs without immediate external RAM.
- Generous I/O count: 151 I/Os provide flexibility for interfacing to sensors, controllers, and peripherals without extensive external buffering.
- Low-voltage operation: 1.425 V to 1.575 V supply compatibility fits modern low-voltage systems and can simplify power-rail design.
- Surface-mount BFQFP package: 208-pin package in a 28 × 28 mm footprint offers a balance of pin count and board space for compact assemblies.
- RoHS compliant and commercial grade: Meets RoHS requirements and is specified for 0 °C to 85 °C operation for standard commercial deployments.
Why Choose M1A3P250-PQG208?
The M1A3P250-PQG208 positions itself as a compact, mid-density FPGA solution that brings together 250k gates, 6,144 logic elements, and 151 I/Os in a surface-mount 208-BFQFP package. Its low-voltage supply and on-chip memory make it suitable for embedded projects that require moderate programmable logic capacity and flexible interfacing while maintaining a small board footprint.
This device is well suited for designers and teams developing commercial embedded systems who need verifiable specifications for logic capacity, I/O availability, package type, and operating range, backed by Microchip Technology’s product lineage and RoHS compliance.
Request a quote or submit a parts inquiry to evaluate M1A3P250-PQG208 for your next design and receive pricing and availability details.

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