M1AGL1000V5-FG484I

IC FPGA 300 I/O 484FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 300 147456 24576 484-BGA

Quantity 527 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O300Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1AGL1000V5-FG484I – IGLOO Field Programmable Gate Array (FPGA) IC, 300 I/O, 24,576 logic elements

The M1AGL1000V5-FG484I is an IGLOO Field Programmable Gate Array (FPGA) IC designed for industrial-grade, surface-mount integration. It provides a configurable logic platform with 24,576 logic elements, 147,456 bits of on-chip RAM, and up to 300 I/O pins for dense digital designs.

With a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 85 °C, this device is specified for industrial environments that require a high gate count and substantial I/O capacity in a 484-BGA package.

Key Features

  • Logic Capacity  24,576 logic elements (cells) offering a high level of configurable digital resources for complex logic implementation.
  • Embedded Memory  Total on-chip RAM of 147,456 bits (approximately 0.15 Mbits) to support configuration-state storage and local buffering.
  • I/O Density  Up to 300 I/O pins to support extensive peripheral interfacing and high-pin-count designs.
  • Gate Count  Approximately 1,000,000 gates, enabling implementation of sizable digital functions and data paths.
  • Power  Supplies operate within a 1.425 V to 1.575 V range, suitable for designs targeting that core-voltage window.
  • Package and Mounting  484-BGA, supplier device package 484-FPBGA (23 × 23), surface-mount configuration for compact board-level integration.
  • Industrial Temperature Range  Rated for −40 °C to 85 °C operation to meet industrial deployment requirements.
  • Regulatory Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Use the device's industrial operating range and extensive logic/I/O resources to implement control algorithms, sequencers, and interface logic in factory automation equipment.
  • Custom Digital Logic  Deploy the FPGA to realize custom state machines, data-paths, and protocol bridges where 24,576 logic elements and on-chip RAM are needed.
  • High-Density I/O Systems  Leverage up to 300 I/O pins for applications that require many external connections, such as sensor arrays or multi-channel signal aggregation.

Unique Advantages

  • High Logic Integration:  24,576 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
  • Substantial On-Chip Memory:  Approximately 0.15 Mbits of embedded RAM supports local buffering and state retention without external memory.
  • Large I/O Capability:  300 I/O pins support broad peripheral connectivity and multi-channel interfaces directly from the device.
  • Industrial Temperature Rating:  Designed for −40 °C to 85 °C operation, suitable for systems exposed to extended temperature ranges.
  • Compact BGA Package:  484-FPBGA (23 × 23) provides a high pin count in a compact surface-mount footprint for space-constrained PCBs.
  • RoHS Compliant:  Meets RoHS environmental requirements for lead-free assembly.

Why Choose M1AGL1000V5-FG484I?

The M1AGL1000V5-FG484I delivers a combination of high logic density, significant on-chip memory, and extensive I/O in an industrial-temperature, surface-mount BGA package. Its specification set is targeted at engineers needing a configurable, gate-dense FPGA solution for industrial and high-I/O embedded designs.

This part is well suited to projects that demand consolidation of complex digital functions, reliable operation across −40 °C to 85 °C, and a compact 484-BGA package for system-level integration. The device's defined supply and packaging parameters help streamline board-level design and procurement decisions.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for M1AGL1000V5-FG484I.

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