M1AGL1000V5-FG484I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 300 147456 24576 484-BGA |
|---|---|
| Quantity | 527 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1AGL1000V5-FG484I – IGLOO Field Programmable Gate Array (FPGA) IC, 300 I/O, 24,576 logic elements
The M1AGL1000V5-FG484I is an IGLOO Field Programmable Gate Array (FPGA) IC designed for industrial-grade, surface-mount integration. It provides a configurable logic platform with 24,576 logic elements, 147,456 bits of on-chip RAM, and up to 300 I/O pins for dense digital designs.
With a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 85 °C, this device is specified for industrial environments that require a high gate count and substantial I/O capacity in a 484-BGA package.
Key Features
- Logic Capacity 24,576 logic elements (cells) offering a high level of configurable digital resources for complex logic implementation.
- Embedded Memory Total on-chip RAM of 147,456 bits (approximately 0.15 Mbits) to support configuration-state storage and local buffering.
- I/O Density Up to 300 I/O pins to support extensive peripheral interfacing and high-pin-count designs.
- Gate Count Approximately 1,000,000 gates, enabling implementation of sizable digital functions and data paths.
- Power Supplies operate within a 1.425 V to 1.575 V range, suitable for designs targeting that core-voltage window.
- Package and Mounting 484-BGA, supplier device package 484-FPBGA (23 × 23), surface-mount configuration for compact board-level integration.
- Industrial Temperature Range Rated for −40 °C to 85 °C operation to meet industrial deployment requirements.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Industrial Control Use the device's industrial operating range and extensive logic/I/O resources to implement control algorithms, sequencers, and interface logic in factory automation equipment.
- Custom Digital Logic Deploy the FPGA to realize custom state machines, data-paths, and protocol bridges where 24,576 logic elements and on-chip RAM are needed.
- High-Density I/O Systems Leverage up to 300 I/O pins for applications that require many external connections, such as sensor arrays or multi-channel signal aggregation.
Unique Advantages
- High Logic Integration: 24,576 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
- Substantial On-Chip Memory: Approximately 0.15 Mbits of embedded RAM supports local buffering and state retention without external memory.
- Large I/O Capability: 300 I/O pins support broad peripheral connectivity and multi-channel interfaces directly from the device.
- Industrial Temperature Rating: Designed for −40 °C to 85 °C operation, suitable for systems exposed to extended temperature ranges.
- Compact BGA Package: 484-FPBGA (23 × 23) provides a high pin count in a compact surface-mount footprint for space-constrained PCBs.
- RoHS Compliant: Meets RoHS environmental requirements for lead-free assembly.
Why Choose M1AGL1000V5-FG484I?
The M1AGL1000V5-FG484I delivers a combination of high logic density, significant on-chip memory, and extensive I/O in an industrial-temperature, surface-mount BGA package. Its specification set is targeted at engineers needing a configurable, gate-dense FPGA solution for industrial and high-I/O embedded designs.
This part is well suited to projects that demand consolidation of complex digital functions, reliable operation across −40 °C to 85 °C, and a compact 484-BGA package for system-level integration. The device's defined supply and packaging parameters help streamline board-level design and procurement decisions.
Request a quote or submit a pricing inquiry to obtain availability and lead-time information for M1AGL1000V5-FG484I.

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