M1AGL1000V5-FGG256I

IC FPGA 177 I/O 256FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 177 147456 24576 256-LBGA

Quantity 1,998 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O177Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1AGL1000V5-FGG256I – IGLOO Field Programmable Gate Array (FPGA) IC, 256-LBGA

The M1AGL1000V5-FGG256I is an IGLOO series Field Programmable Gate Array (FPGA) IC providing a substantial programmable logic fabric, on-chip memory and a high I/O count in a compact 256-LBGA package. This device is offered in an industrial temperature grade and is intended for designs that require configurable logic, embedded RAM and a large number of I/O connections.

With 24,576 logic elements, approximately 0.147 Mbits of embedded memory and 177 I/O pins, the device balances integration and I/O capability while operating from a 1.425 V to 1.575 V supply and supporting surface-mount assembly in a 256-FPBGA (17×17) footprint.

Key Features

  • Programmable Logic Fabric  24,576 logic elements (cells) provide ample configurable logic capacity for combinational and sequential designs.
  • Embedded Memory  Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) to support data buffering, state storage and local memory needs.
  • I/O Density  177 general-purpose I/O pins accommodate interfaces to sensors, peripherals and external logic devices.
  • Logic Scale  Equivalent to 1,000,000 gates, enabling complex logic implementations and function consolidation.
  • Power  Operates from a 1.425 V to 1.575 V supply range to match system power rails and design constraints.
  • Package and Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) designed for surface-mount assembly in compact board layouts.
  • Industrial Temperature  Rated for an operating range of −40 °C to 85 °C for industrial-environment deployments.
  • Regulatory  RoHS compliant for environmental and assembly process compatibility.

Typical Applications

  • Industrial Automation  Implement control logic, real-time signal processing and I/O aggregation for factory and process automation systems operating in industrial temperature ranges.
  • Embedded Systems  Serve as the configurable logic core in embedded platforms that require on-chip RAM and a substantial number of general-purpose I/Os.
  • Prototyping and Development  Provide a flexible platform for hardware validation and design iteration where reprogrammable logic and moderate embedded memory are needed.

Unique Advantages

  • High Logic Capacity: 24,576 logic elements deliver the resource headroom to integrate multiple functions into a single device.
  • Integrated On-Chip Memory: 147,456 bits of RAM reduce dependence on external memory for buffering and local storage.
  • Generous I/O Count: 177 I/O pins simplify interfacing to multiple peripherals, sensors and external subsystems without additional I/O expanders.
  • Industrial Reliability: Specified −40 °C to 85 °C operating range supports deployment in industrial environments.
  • Compact, Surface-Mount Package: 256-FPBGA (17×17) package enables dense PCB integration while supporting standard surface-mount assembly processes.
  • Regulatory Compliance: RoHS compliance aligns with modern manufacturing and environmental requirements.

Why Choose M1AGL1000V5-FGG256I?

The M1AGL1000V5-FGG256I positions itself as a versatile IGLOO FPGA option for designers seeking a balance of programmable logic, embedded memory and a high I/O count within an industrial temperature envelope. Its combination of 24,576 logic elements, approximately 0.147 Mbits of on-chip RAM and 177 I/O pins makes it suitable for consolidating functions and reducing external component count in mid- to high-complexity designs.

This device is well suited for teams and projects prioritizing long-term robustness and integration: the industrial grade temperature specification, surface-mount 256-FPBGA package and RoHS compliance help ensure consistent manufacturability and field performance.

Request a quote or submit an inquiry to check pricing, lead times and availability for M1AGL1000V5-FGG256I. Our team will provide the information needed to move your design forward.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up