M1AGL1000V5-FGG144
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 97 147456 24576 144-LBGA |
|---|---|
| Quantity | 393 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1AGL1000V5-FGG144 – IGLOO Field Programmable Gate Array (FPGA), 97 I/Os, 144-LBGA
The M1AGL1000V5-FGG144 is an IGLOO family, flash-based FPGA offered in a 144-LBGA (144-FPBGA 13×13) surface-mount package. As an M1 IGLOO device, it supports implementation of the ARM Cortex‑M1 soft processor in the FPGA fabric and targets low-power, single-chip embedded systems.
With 24,576 logic elements, approximately 147,456 bits of on-chip SRAM and 97 general-purpose I/Os, this device is designed for applications that require reprogrammability, low active and ultra-low standby power, and compact package integration within commercial temperature ranges.
Key Features
- Core capacity — Approximately 1,000,000 system gates and 24,576 logic elements provide FPGA fabric density for complex glue logic, control and signal processing tasks.
- On-chip memory — 147,456 bits (≈144 Kbits) of embedded true dual-port SRAM for block storage and buffering within designs.
- I/O and mixed-voltage support — 97 user I/Os in a pin-compatible IGLOO family package; family-level I/O supports a range of voltage standards and bank-selectable voltages.
- Low-power architecture — Flash-based, reprogrammable nonvolatile configuration with Flash*Freeze and low-power active modes described for IGLOO devices to enable ultra-low standby and system power management.
- M1 (ARM) support — M1 IGLOO devices support implementation of the 32-bit Cortex‑M1 soft processor in the FPGA fabric (ARM-enabled devices with ordering prefix M1AGL); note ARM-enabled IGLOO devices do not support AES decryption via on-chip ISP.
- Single-voltage core support — Core supply specified at 1.425 V to 1.575 V for device operation.
- Package and mounting — 144-LBGA (supplier package 144-FPBGA 13×13), surface-mount package suitable for compact board designs.
- Commercial temperature grade — Rated for 0 °C to 70 °C operating temperature.
- RoHS compliant — Conforms to RoHS environmental requirements.
Typical Applications
- Low-power embedded controllers — Use the device’s low-power modes and reprogrammable flash to implement always-on monitoring, control logic or power-management functions.
- Interface bridging and protocol adaptation — Implement glue logic and protocol converters where compact FPGA fabric and a moderate I/O count simplify board-level designs.
- Compact, single-chip systems — Leverage nonvolatile configuration and on-chip RAM to build instant-on, reprogrammable modules in space-constrained products.
Unique Advantages
- Flash-based nonvolatile configuration: Retains programmed design when powered off and enables reprogrammability without external configuration PROMs, reducing BOM complexity.
- Low standby and active power modes: Flash*Freeze and low-power active capabilities allow designs to minimize system power consumption while retaining state, extending battery life or lowering system energy use.
- M1 processor support: Native support for implementing the Cortex‑M1 soft processor in fabric provides a path to embed control software directly within the FPGA design.
- Compact package integration: 144-LBGA surface-mount package delivers a small footprint for higher-density board layouts and simplified mechanical design.
- Commercial-grade robustness: Specified operation across 0 °C to 70 °C and RoHS compliance support broad commercial applications and regulatory environmental alignment.
Why Choose M1AGL1000V5-FGG144?
The M1AGL1000V5-FGG144 combines substantial FPGA fabric capacity—24,576 logic elements and roughly 147 Kbits of on-chip SRAM—with flash-based nonvolatile configuration and low-power capabilities characteristic of the IGLOO family. This makes it suitable for commercial embedded designs that require reprogrammability, integrated processor capability via Cortex‑M1, and compact package integration.
Designers targeting lower-power single-chip solutions, compact interface controllers, or reprogrammable control subsystems will find the device’s mix of logic density, on-chip memory and I/O count a practical match for time-to-market and BOM-reduction goals while operating within commercial temperature limits.
If you would like pricing, availability, or to request a quote for the M1AGL1000V5-FGG144, please submit a quote request or contact sales to get further assistance.

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