M1AGL250V5-FG144I

IC FPGA 97 I/O 144FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 97 36864 6144 144-LBGA

Quantity 1,703 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of M1AGL250V5-FG144I – IGLOO FPGA, 97 I/Os, 6,144 Logic Elements, 144-LBGA

The M1AGL250V5-FG144I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 6,144 logic elements, approximately 36.9 kbits of on-chip RAM (36,864 total RAM bits) and up to 97 general-purpose I/O in a compact 144-LBGA package.

Specified for industrial use with an operating temperature range of −40°C to 85°C and a core supply range of 1.425 V to 1.575 V, this device targets embedded designs that require moderate logic density, on-chip memory and flexible I/O in a surface-mount LBGA footprint.

Key Features

  • Core and Logic  6,144 logic elements (cells) supporting an equivalent of 250,000 gates for mid-density logic integration.
  • On-chip Memory  Total RAM bits: 36,864 (approximately 36.9 kbits) for embedded data buffering and state storage.
  • I/O Capacity  Up to 97 general-purpose I/O pins to support interface-rich designs and peripheral connectivity.
  • Package and Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13); surface-mount mounting type for compact board-level integration.
  • Power  Core supply specified between 1.425 V and 1.575 V for consistent voltage planning in system power architectures.
  • Operating Range and Grade  Industrial grade with operating temperature from −40°C to 85°C for deployment in temperature-demanding environments.

Typical Applications

  • Industrial Control and Automation  Leverages industrial temperature rating and I/O count for control logic, sensor interfaces and real-time processing in automation equipment.
  • Embedded Processing and Glue Logic  Provides mid-range logic density and on-chip RAM suitable for custom processing blocks, state machines and peripheral glue logic.
  • I/O-Intensive Interfaces  Supports protocol bridging, signal aggregation and multi-peripheral interfaces using up to 97 I/O pins.
  • Compact Board-Level Integration  144-LBGA surface-mount package enables space-efficient implementations where board area and component count are constrained.

Unique Advantages

  • Highly integrated logic and memory: Combines 6,144 logic elements with 36,864 bits of on-chip RAM to reduce the need for external components.
  • Generous I/O budget: Ninety-seven I/O pins provide flexibility for multi-interface designs and peripheral expansion without added I/O expander ICs.
  • Industrial-grade operating range: −40°C to 85°C rating supports deployment in temperature-variable environments common in industrial systems.
  • Compact, surface-mount LBGA packaging: 144-LBGA (13×13) delivers a dense board footprint for space-constrained applications.
  • Predictable core supply: Narrow voltage supply range (1.425 V to 1.575 V) simplifies power-supply planning and regulation design.
  • Manufacturer pedigree: Supplied by Microchip Technology, providing traceable sourcing for production designs.

Why Choose M1AGL250V5-FG144I?

The M1AGL250V5-FG144I is positioned for designers who need a balanced FPGA solution offering moderate logic density, embedded RAM and substantial I/O in an industrial-grade, surface-mount LBGA package. Its combination of 6,144 logic elements, 36,864 bits of on-chip RAM and 97 I/Os makes it appropriate for embedded and interface-centric designs where board area, I/O count and operating temperature range are key considerations.

Backed by Microchip Technology, this device supports designs that require stable core-voltage planning and industrial temperature operation while maintaining a compact package footprint for efficient BOM and board-level integration.

Request a quote or submit an inquiry for pricing and availability of the M1AGL250V5-FG144I to begin procurement or integration planning.

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