M1AGL250V5-FGG144
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 97 36864 6144 144-LBGA |
|---|---|
| Quantity | 338 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of M1AGL250V5-FGG144 – IGLOO FPGA IC, 6,144 Logic Elements, 144-LBGA
The M1AGL250V5-FGG144 is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial embedded applications. It provides a compact, surface-mount FPGA solution with 6,144 logic elements, approximately 36,864 bits of on-chip RAM and support for up to 97 user I/O pins.
With a logic capacity equivalent to about 250,000 gates and a focused supply range of 1.425 V to 1.575 V, this device targets designs that require moderate logic density, flexible I/O integration and a compact 144-LBGA footprint (144-FPBGA, 13×13 mm).
Key Features
- Logic Capacity 6,144 logic elements providing the equivalent of approximately 250,000 gates for implementing custom digital logic and glue-logic functions.
- Embedded Memory Total on-chip RAM of 36,864 bits to support FIFOs, small buffers and state storage within the FPGA fabric.
- I/O Resources Up to 97 user I/O pins to connect sensors, peripherals, buses and external devices directly to the FPGA.
- Power Supply Range Operates from a core supply of 1.425 V to 1.575 V, enabling precise power planning for embedded systems.
- Package & Mounting Surface-mount 144-LBGA package (supplier package: 144-FPBGA, 13×13) for compact board layouts and high-density designs.
- Operating Conditions Commercial-grade operating temperature range of 0 °C to 70 °C suitable for typical commercial electronics environments.
- Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Consumer Electronics — Implement custom control logic, peripheral bridging or feature offload in compact consumer devices that require moderate logic density and multiple I/O.
- Embedded Systems — Integrate glue logic, protocol adapters or custom state machines within industrial-grade boards that use commercial-grade components.
- Communications Equipment — Provide protocol handling, interface conditioning and small buffer memory in communication modules with up to 97 I/O connections.
- Prototyping & Custom IP — Validate and deploy custom IP blocks and mixed-function logic in a compact LBGA package for evaluation and low-to-mid volume designs.
Unique Advantages
- Balanced Logic and Memory — 6,144 logic elements paired with 36,864 bits of on-chip RAM provide the right balance for control logic, state machines and small buffering tasks without external RAM.
- High I/O Count in a Compact Package — Up to 97 user I/O in a 144-LBGA (13×13) footprint enables dense board layouts while maintaining flexible peripheral connectivity.
- Defined Power Envelope — A narrow supply range (1.425 V–1.575 V) simplifies power-supply design and voltage regulation planning for embedded systems.
- Commercial-Grade Fit — Specified for 0 °C to 70 °C operation, matching the requirements of mainstream commercial electronics applications.
- RoHS Compliance — Helps meet environmental manufacturing requirements and simplifies regulatory planning.
Why Choose M1AGL250V5-FGG144?
The M1AGL250V5-FGG144 positions itself as a compact, mid-density FPGA choice for commercial embedded designs that need a balance of logic capacity, on-chip memory and a substantial I/O count. Its 144-LBGA package and surface-mount mounting make it suitable for space-efficient board designs where integration and I/O flexibility matter.
This part is well suited to engineers and procurement teams building commercial electronics, communication modules and prototype systems that require a reliable, RoHS-compliant FPGA with clearly defined electrical and thermal operating parameters. The combination of logic elements, RAM and I/O enables scalable designs and straightforward integration into existing PCB footprints.
Request a quote or submit a pricing request for the M1AGL250V5-FGG144 to evaluate fit for your next commercial FPGA-based design.

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