M1AGL250V5-FGG144

IC FPGA 97 I/O 144FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 97 36864 6144 144-LBGA

Quantity 338 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of M1AGL250V5-FGG144 – IGLOO FPGA IC, 6,144 Logic Elements, 144-LBGA

The M1AGL250V5-FGG144 is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial embedded applications. It provides a compact, surface-mount FPGA solution with 6,144 logic elements, approximately 36,864 bits of on-chip RAM and support for up to 97 user I/O pins.

With a logic capacity equivalent to about 250,000 gates and a focused supply range of 1.425 V to 1.575 V, this device targets designs that require moderate logic density, flexible I/O integration and a compact 144-LBGA footprint (144-FPBGA, 13×13 mm).

Key Features

  • Logic Capacity 6,144 logic elements providing the equivalent of approximately 250,000 gates for implementing custom digital logic and glue-logic functions.
  • Embedded Memory Total on-chip RAM of 36,864 bits to support FIFOs, small buffers and state storage within the FPGA fabric.
  • I/O Resources Up to 97 user I/O pins to connect sensors, peripherals, buses and external devices directly to the FPGA.
  • Power Supply Range Operates from a core supply of 1.425 V to 1.575 V, enabling precise power planning for embedded systems.
  • Package & Mounting Surface-mount 144-LBGA package (supplier package: 144-FPBGA, 13×13) for compact board layouts and high-density designs.
  • Operating Conditions Commercial-grade operating temperature range of 0 °C to 70 °C suitable for typical commercial electronics environments.
  • Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Consumer Electronics — Implement custom control logic, peripheral bridging or feature offload in compact consumer devices that require moderate logic density and multiple I/O.
  • Embedded Systems — Integrate glue logic, protocol adapters or custom state machines within industrial-grade boards that use commercial-grade components.
  • Communications Equipment — Provide protocol handling, interface conditioning and small buffer memory in communication modules with up to 97 I/O connections.
  • Prototyping & Custom IP — Validate and deploy custom IP blocks and mixed-function logic in a compact LBGA package for evaluation and low-to-mid volume designs.

Unique Advantages

  • Balanced Logic and Memory — 6,144 logic elements paired with 36,864 bits of on-chip RAM provide the right balance for control logic, state machines and small buffering tasks without external RAM.
  • High I/O Count in a Compact Package — Up to 97 user I/O in a 144-LBGA (13×13) footprint enables dense board layouts while maintaining flexible peripheral connectivity.
  • Defined Power Envelope — A narrow supply range (1.425 V–1.575 V) simplifies power-supply design and voltage regulation planning for embedded systems.
  • Commercial-Grade Fit — Specified for 0 °C to 70 °C operation, matching the requirements of mainstream commercial electronics applications.
  • RoHS Compliance — Helps meet environmental manufacturing requirements and simplifies regulatory planning.

Why Choose M1AGL250V5-FGG144?

The M1AGL250V5-FGG144 positions itself as a compact, mid-density FPGA choice for commercial embedded designs that need a balance of logic capacity, on-chip memory and a substantial I/O count. Its 144-LBGA package and surface-mount mounting make it suitable for space-efficient board designs where integration and I/O flexibility matter.

This part is well suited to engineers and procurement teams building commercial electronics, communication modules and prototype systems that require a reliable, RoHS-compliant FPGA with clearly defined electrical and thermal operating parameters. The combination of logic elements, RAM and I/O enables scalable designs and straightforward integration into existing PCB footprints.

Request a quote or submit a pricing request for the M1AGL250V5-FGG144 to evaluate fit for your next commercial FPGA-based design.

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