M1AGL250V5-VQ100

IC FPGA 68 I/O 100VQFP
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 68 36864 6144 100-TQFP

Quantity 68 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O68Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of M1AGL250V5-VQ100 – IGLOO Field Programmable Gate Array (FPGA) IC, 68 I/Os, 36,864-bit RAM, 6,144 logic elements, 100-TQFP

The M1AGL250V5-VQ100 is an IGLOO family flash FPGA optimized for low-power, single-chip embedded designs. Based on the IGLOO low-power flash FPGA architecture, it combines reprogrammable nonvolatile configuration, a compact 100‑TQFP package, and hardware resources suited for control, interface, and signal-processing tasks in commercial-grade systems.

This device is targeted at applications that require ultra-low-power standby and rapid wake-up, mixed-voltage I/O flexibility, and on-chip logic and RAM for moderate-density designs. It is specified for commercial operation from 0 °C to 70 °C and is RoHS compliant.

Key Features

  • Logic Capacity — 6,144 logic elements (approximately 250,000 system gates) provide programmable fabric for control, glue logic, and custom processing.
  • Embedded Memory — Total on-chip RAM of 36,864 bits plus 1 kbit of on-chip reprogrammable FlashROM for configuration storage and small data retention.
  • Low-Power Modes — Flash*Freeze ultra-low-power retention mode consumes as little as 5 μW; Low Power Active (static idle) operation available from 12 μW, enabling minimal power draw while remaining functional.
  • Power Supply — Device voltage supply specified at 1.425 V to 1.575 V to support core operation within defined limits.
  • I/O and Interfaces — 68 user I/Os; AGL250-class devices support high-speed DDR (up to 700 Mbps) and LVDS-capable I/Os and mixed-voltage operation across common I/O standards.
  • Clocking and Timing — Six clock conditioning (CCC) blocks with one integrated PLL for on-chip clock conditioning, phase shift, and multiply/divide functionality.
  • Package and Mounting — 100‑TQFP package (supplier device package: 100‑VQFP, 14×14 mm); surface-mount mounting type for compact board-level integration.
  • Security & Programming — Reprogrammable flash configuration supports instant-on behavior; ARM-enabled ordering numbers (M1AGL prefix) do not support on-chip AES decryption per family documentation.
  • Commercial Grade & Compliance — Specified for 0 °C to 70 °C operation and RoHS compliant for worldwide commercial applications.

Typical Applications

  • Low-power embedded controllers — Use Flash*Freeze and Low Power Active modes to implement controllers that monitor system inputs while minimizing standby current.
  • Sensor aggregation and interface bridging — Combine multiple sensor inputs, perform preprocessing, and present consolidated interfaces using available logic and RAM.
  • High-speed I/O and protocol conversion — Leverage DDR-capable and LVDS-capable I/Os for high-throughput signaling and protocol translation in communication or data-acquisition fronts.
  • Soft-processor implementations — Implement Cortex‑M1 soft processor cores within the FPGA fabric for embedded control and deterministic firmware tasks (M1 IGLOO support noted in family documentation).

Unique Advantages

  • Ultra-low standby power: Flash*Freeze retention at micro-watt levels enables designs with long idle periods and immediate wake-up capability while retaining SRAM/register state.
  • Single-chip, nonvolatile configuration: On-chip flash removes the need for external configuration memory and enables instant-on behavior for faster system startup.
  • Mixed-voltage, high-speed I/O: AGL250-class I/O capabilities support a wide range of signaling standards and high-speed interfaces to simplify board-level design.
  • Compact surface-mount package: 100‑TQFP (14×14 mm) package balances I/O count and board footprint for space-constrained applications.
  • Integrated clocking resources: Multiple CCC blocks and an integrated PLL enable flexible clock generation and distribution without external clock-conditioning components.
  • Commercial-grade reliability: Designed for 0 °C to 70 °C operation and RoHS compliance for standard commercial deployable products.

Why Choose M1AGL250V5-VQ100?

The M1AGL250V5-VQ100 delivers a balanced combination of low-power operation, reprogrammable nonvolatile configuration, and moderate FPGA resources ideal for commercial embedded designs. With 6,144 logic elements, approximately 36,864 bits of embedded RAM, flexible high-speed I/Os, and integrated clock-conditioning blocks, it supports control, interfacing, and preprocessing tasks without large external component counts.

This part is well suited for designers who need a compact, surface-mount FPGA with instant-on capability and ultra-low standby power, and who prefer the predictability of flash-based configuration for commercial products. Its family-level features, such as Flash*Freeze and CCC/PLL resources, provide system-level power and clock management advantages while keeping BOM complexity low.

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