M1AGL600V2-CS281I

The M1AGL600V2-CS281I is an IGLOO field-programmable gate array (FPGA) manufactured by Microchip Technology. It provides a programmable logic fabric with a balanced combination of logic capacity, on-chip memory, and I/O density in a compact BGA package.

Targeted for industrial-class deployments, this device is suited for embedded and control-oriented applications that require configurable logic, moderate embedded memory, and up to 215 external I/O connections while operating across an industrial temperature range.

Key Features

• Logic Capacity — 13,824 logic elements (cells), enabling implementation of mid-sized custom logic, state machines, and glue logic.
• Embedded Memory — 110,592 total RAM bits (approximately 0.11 Mbits) for on-chip buffering, FIFOs, and small data structures.
• I/O Resources — Up to 215 I/O pins to support diverse peripheral interfaces and board-level connectivity.
• Gate Count — Approximately 600,000 gates of functional capacity for application-specific logic integration.
• Power Supply — Core voltage range of 1.14 V to 1.575 V to match system power-rail design requirements.
• Package & Mounting — 281-TFBGA (CSBGA), supplier device package listed as 281-CSP (10×10); surface-mount package suitable for compact board designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 85 °C for deployment in typical industrial environments.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• Industrial Control and Automation — Implement custom control logic, protocol handling, and deterministic I/O with support for industrial temperature operation.
• Embedded and Edge Processing — Use on-chip logic and embedded RAM for preprocessing, data aggregation, or lightweight signal processing at the edge.
• I/O-Intensive Interface Bridging — Leverage 215 I/O pins to consolidate multiple interfaces and adapt signal levels between subsystems.
• Prototyping and Custom Logic Integration — Medium-density logic and on-chip memory make the device suitable for validating application-specific architectures and integrating glue logic.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements with 110,592 bits of RAM provide a practical mix of resources for mid-range FPGA designs.
• High I/O Count: 215 available I/Os support dense connectivity and reduce the need for additional interface components.
• Compact BGA Packaging: 281-TFBGA/281-CSP (10×10) packaging enables space-efficient, surface-mount integration on modern PCBs.
• Industrial Temperature Support: Rated from −40 °C to 85 °C for reliable operation in standard industrial environments.
• Regulatory Compliance: RoHS compliance supports environmentally conscious design and regulatory requirements.

Why Choose M1AGL600V2-CS281I?

The M1AGL600V2-CS281I delivers a practical combination of logic density, embedded memory, and I/O capacity in a compact, surface-mount BGA package from Microchip Technology. Its specifications suit designers who need configurable logic resources with industrial temperature capability and a high pin count for interfacing multiple peripherals.

This device is well-suited for engineers and procurement teams developing mid-range embedded systems, industrial controllers, and interface bridge solutions that benefit from FPGA-based customization, on-chip RAM, and a compact board-level footprint.

Request a quote or submit an RFQ to check availability and pricing for the M1AGL600V2-CS281I.