M1AGL600V2-CSG281I

The M1AGL600V2-CSG281I is an IGLOO Field Programmable Gate Array (FPGA) in a 281-TFBGA surface-mount package. It delivers a balance of on-chip logic, embedded RAM, and I/O density suitable for industrial applications that require configurable digital logic and robust temperature operation.

Key architectural attributes include 13,824 logic elements, 110,592 bits of on-chip RAM, and 215 I/Os, providing the resources for medium-complexity programmable logic designs while supporting operation across a wide supply voltage and industrial temperature range.

Key Features

• Logic Capacity  13,824 logic elements (cells) to implement custom digital functions and state machines.
• Embedded Memory  110,592 total RAM bits (approximately 0.11 Mbits) for data buffering, FIFOs, and small lookup tables.
• I/O Resources  215 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Gate Count  Approximately 600,000 gates of logic capacity for aggregate design sizing and partitioning.
• Power Supply Range  Operates from 1.14 V to 1.575 V, enabling compatibility with low-voltage system rails.
• Industrial Temperature Rating  Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
• Package and Mounting  281-TFBGA package (supplier device package: 281-CSP, 10×10) in a surface-mount form factor for compact board layouts.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Industrial control and automation  Meets industrial temperature requirements and provides ample I/O and logic resources for control, sequencing, and interface tasks.
• Embedded processing and peripherals  On-chip RAM and logic density support embedded processing functions, protocol bridging, and custom peripheral implementation.
• Compact, high-density boards  The 281-TFBGA (281-CSP, 10×10) surface-mount package enables space-efficient integration on constrained PCBs.

Unique Advantages

• Integrated logic and memory: Combining 13,824 logic elements with 110,592 bits of RAM reduces the need for external memory and simplifies board design.
• High I/O count: 215 I/Os accommodate multiple external interfaces and sensors without extensive I/O expander circuitry.
• Industrial-ready thermal range: −40 °C to 85 °C rating supports deployments in industrial environments and extended-temperature systems.
• Low-voltage operation: 1.14 V to 1.575 V supply range supports modern low-voltage power architectures.
• Compact package: 281-TFBGA / 281-CSP (10×10) surface-mount package enables high-density, compact PCB layouts.
• RoHS compliant: Meets common environmental compliance requirements for lead-free manufacturing.

Why Choose M1AGL600V2-CSG281I?

The M1AGL600V2-CSG281I positions itself as a practical, industrial-grade FPGA option offering a solid combination of logic density, embedded RAM, and high I/O count in a compact surface-mount package. Its voltage flexibility and industrial temperature rating make it appropriate for designs that require reliable, configurable logic functionality under real-world operating conditions.

This device is suited for engineers and procurement teams building mid-complexity programmable logic solutions where board space, I/O integration, and temperature robustness are key considerations. Its specification set supports scalable design choices while aligning with RoHS manufacturing requirements.

Request a quote or submit an RFQ today to check pricing and availability for M1AGL600V2-CSG281I.