M1AGL600V2-FG256

IC FPGA 177 I/O 256FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 177 110592 13824 256-LBGA

Quantity 567 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O177Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1AGL600V2-FG256 – IGLOO Field Programmable Gate Array (FPGA) IC, 600k Gates, 13,824 Logic Elements, 110,592 bits RAM, 256-LBGA

The M1AGL600V2-FG256 is a Microchip Technology IGLOO flash-based FPGA optimized for low-power, single-chip system designs. Based on the IGLOO family architecture, it combines reprogrammable flash configuration with embedded logic and memory to support compact, power-sensitive applications.

With 13,824 logic elements, approximately 110,592 bits of on-chip RAM and 177 user I/Os in a 256-LBGA package, this commercial-grade device targets embedded control, power-management and I/O‑rich designs that require low standby power and instant-on capability.

Key Features

  • Core Logic  13,824 logic elements (CLBs) delivering up to 600,000 system gates for medium-density FPGA implementations.
  • Embedded Memory  Approximately 110,592 bits of true dual-port SRAM for on-chip data buffering and state storage.
  • Low-Power Modes  Flash*Freeze technology enables ultra-low power retention (as low as 5 μW) while preserving SRAM and register contents; Low Power Active capability allows operation from approximately 12 μW when idle.
  • Integrated Processor Support  M1 IGLOO devices support implementation of the 32-bit Cortex-M1 soft processor in the FPGA fabric for embedded control tasks.
  • I/O and Voltage Flexibility  177 user I/Os with mixed-voltage operation and bank-selectable I/O voltages; core supply range specified at 1.14 V to 1.575 V.
  • Package and Mounting  256-LBGA (supplier package 256-FPBGA, 17×17) surface-mount package suitable for space-constrained PCBs.
  • Commercial Temperature Grade  Rated for 0 °C to 70 °C operating temperature for standard commercial applications.
  • Reprogrammable Flash Technology  Nonvolatile flash configuration provides instant-on behavior and retains programmed design when powered off.

Typical Applications

  • Embedded Control and Power Management  Use the device’s low-power modes and embedded processor support to implement system power sequencing, keyboard scanning or supervisory control while minimizing standby energy.
  • Portable and Battery-Powered Equipment  Flash nonvolatile configuration plus ultra-low-power retention modes enable instant-on functionality and extended standby life in portable products.
  • I/O-Rich Interface Functions  The 177 I/Os and mixed-voltage operation make the part suitable for bridging, protocol adaptation and user-interface control where multiple voltage domains are present.
  • High-Density Single-Chip Designs  Combine logic, RAM and optional soft processor in a single package to reduce BOM and PCB area for medium-complexity systems.

Unique Advantages

  • Single-Chip, Reprogrammable Solution: Flash-based nonvolatile configuration provides instant-on operation and simplifies system design by eliminating external configuration memory.
  • Ultra-Low Power Retention: Flash*Freeze mode can reduce power to as little as 5 μW while retaining state, enabling aggressive power-management strategies.
  • Embedded Processing Option: Support for the Cortex-M1 soft processor allows integration of a 32-bit control core directly in the FPGA fabric for real-time control and firmware flexibility.
  • Balanced Logic and Memory: 13,824 logic elements and roughly 110,592 bits of on-chip RAM support complex logic functions and local buffering without external memory.
  • Flexible I/O and Mixed-Voltage Support: 177 I/Os with bank-selectable voltages accommodate multiple interface standards and simplify level‑shifting requirements.
  • Compact Surface-Mount Package: 256-LBGA (17×17 FPBGA) enables dense PCB integration in space-constrained systems.

Why Choose M1AGL600V2-FG256?

The M1AGL600V2-FG256 positions itself as a practical, low-power FPGA choice for designers who need a balance of logic density, embedded memory and I/O flexibility in a compact, reprogrammable package. Its flash configuration and ultra-low-power retention modes make it well suited to designs requiring instant-on behavior and extended standby life.

This device is appropriate for engineers building medium-complexity embedded systems, portable products, or I/O-centric controllers that benefit from integrated processor support and compact surface-mount packaging. Backed by Microchip Technology’s IGLOO family features, it provides a scalable option for designs that prioritize power efficiency and single-chip integration.

Request a quote or submit an availability inquiry to evaluate M1AGL600V2-FG256 for your next design project.

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