M1AGL600V2-FGG256

IC FPGA 177 I/O 256FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 177 110592 13824 256-LBGA

Quantity 513 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O177Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1AGL600V2-FGG256 – IGLOO Field Programmable Gate Array (FPGA), 13,824 logic elements, 177 I/O, 256-LBGA

The M1AGL600V2-FGG256 is an IGLOO series Field Programmable Gate Array (FPGA) IC designed for commercial electronic applications. It combines a mid-range logic fabric with on-chip embedded RAM and flexible I/O to support a variety of programmable logic functions.

With 13,824 logic elements, approximately 110,592 bits of embedded RAM, and 177 I/O pins in a 256-LBGA package, this device is positioned for commercial designs that require a balance of logic capacity, embedded memory, and compact packaging.

Key Features

  • Core Logic  Provides 13,824 logic elements and an equivalent of 600,000 gates for implementing combinational and sequential logic functions.
  • Embedded Memory  Includes approximately 110,592 bits of on-chip RAM to support buffering, state storage, and small lookup tables.
  • I/O Count  Offers 177 programmable I/O pins to interface with peripherals, sensors, and system buses.
  • Power Supply  Operates from a 1.14 V to 1.575 V supply range to match system core-voltage requirements.
  • Package & Mounting  Supplied in a 256-LBGA package (supplier package: 256-FPBGA 17×17) with surface-mount mounting for compact PCB integration.
  • Operating Conditions  Commercial grade device rated for 0 °C to 70 °C operation.
  • Environmental Compliance  RoHS compliant to meet environmental regulations for lead-free assembly.

Unique Advantages

  • Balanced logic and memory capacity: 13,824 logic elements paired with ~110,592 bits of RAM enable implementations that need moderate logic density and local storage without external memory.
  • Generous I/O availability: 177 I/O pins provide flexibility for interfacing multiple peripherals or parallel buses directly to the FPGA fabric.
  • Compact BGA footprint: 256-LBGA (256-FPBGA 17×17) packaging supports high-density board layouts while maintaining a surface-mount form factor.
  • Commercial deployment ready: Rated for 0 °C to 70 °C operation and specified as commercial grade for standard commercial product environments.
  • Regulatory alignment: RoHS compliance simplifies compliance with lead-free manufacturing requirements.

Why Choose M1AGL600V2-FGG256?

The M1AGL600V2-FGG256 provides a practical combination of logic resources, embedded RAM, and I/O count in a compact 256-LBGA package, making it suitable for commercial designs that need a mid-range FPGA solution. Its voltage operating range and RoHS compliance align with contemporary PCB power architectures and manufacturing requirements.

This device is well suited to engineers and procurement teams seeking a commercially graded, surface-mount FPGA offering clear specifications for logic capacity, memory, I/O, and package dimensions. Its balance of features supports scalable designs where on-chip resources and compact board footprint are important considerations.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the M1AGL600V2-FGG256.

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