M1AGL600V2-FGG256
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 177 110592 13824 256-LBGA |
|---|---|
| Quantity | 513 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 177 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1AGL600V2-FGG256 – IGLOO Field Programmable Gate Array (FPGA), 13,824 logic elements, 177 I/O, 256-LBGA
The M1AGL600V2-FGG256 is an IGLOO series Field Programmable Gate Array (FPGA) IC designed for commercial electronic applications. It combines a mid-range logic fabric with on-chip embedded RAM and flexible I/O to support a variety of programmable logic functions.
With 13,824 logic elements, approximately 110,592 bits of embedded RAM, and 177 I/O pins in a 256-LBGA package, this device is positioned for commercial designs that require a balance of logic capacity, embedded memory, and compact packaging.
Key Features
- Core Logic Provides 13,824 logic elements and an equivalent of 600,000 gates for implementing combinational and sequential logic functions.
- Embedded Memory Includes approximately 110,592 bits of on-chip RAM to support buffering, state storage, and small lookup tables.
- I/O Count Offers 177 programmable I/O pins to interface with peripherals, sensors, and system buses.
- Power Supply Operates from a 1.14 V to 1.575 V supply range to match system core-voltage requirements.
- Package & Mounting Supplied in a 256-LBGA package (supplier package: 256-FPBGA 17×17) with surface-mount mounting for compact PCB integration.
- Operating Conditions Commercial grade device rated for 0 °C to 70 °C operation.
- Environmental Compliance RoHS compliant to meet environmental regulations for lead-free assembly.
Unique Advantages
- Balanced logic and memory capacity: 13,824 logic elements paired with ~110,592 bits of RAM enable implementations that need moderate logic density and local storage without external memory.
- Generous I/O availability: 177 I/O pins provide flexibility for interfacing multiple peripherals or parallel buses directly to the FPGA fabric.
- Compact BGA footprint: 256-LBGA (256-FPBGA 17×17) packaging supports high-density board layouts while maintaining a surface-mount form factor.
- Commercial deployment ready: Rated for 0 °C to 70 °C operation and specified as commercial grade for standard commercial product environments.
- Regulatory alignment: RoHS compliance simplifies compliance with lead-free manufacturing requirements.
Why Choose M1AGL600V2-FGG256?
The M1AGL600V2-FGG256 provides a practical combination of logic resources, embedded RAM, and I/O count in a compact 256-LBGA package, making it suitable for commercial designs that need a mid-range FPGA solution. Its voltage operating range and RoHS compliance align with contemporary PCB power architectures and manufacturing requirements.
This device is well suited to engineers and procurement teams seeking a commercially graded, surface-mount FPGA offering clear specifications for logic capacity, memory, I/O, and package dimensions. Its balance of features supports scalable designs where on-chip resources and compact board footprint are important considerations.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the M1AGL600V2-FGG256.

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