M1AGL600V2-FGG256I

The M1AGL600V2-FGG256I is an IGLOO Field Programmable Gate Array (FPGA) from Microchip Technology, provided in a compact 256-LBGA package. It delivers a substantial logic capacity and embedded memory in a surface-mount module targeted for industrial-grade embedded designs.

With 13,824 logic elements, 177 I/O pins and an industrial operating range, this device supports reconfigurable logic needs where compact footprint, I/O density and reliable operation between -40 °C and 85 °C are required.

Key Features

• Logic Capacity — 13,824 logic elements and 600,000 gates provide substantial programmable logic resources for medium-density designs.
• Embedded Memory — 110,592 bits of on-chip RAM, approximately 0.11 Mbits of embedded memory, for local data buffering and state storage.
• I/O Density — 177 user I/O pins enable flexible interfacing to peripherals, sensors, and other system components.
• Power Supply — Operates from a 1.14 V to 1.575 V supply range to match low-voltage system domains.
• Package and Mounting — 256-LBGA package (supplier device package: 256-FPBGA (17x17)) in a surface-mount form factor for compact board layouts.
• Industrial Temperature Range — Rated for operation from -40 °C to 85 °C to meet industrial-environment requirements.
• Industrial Grade — Specified as an industrial-grade component for use in commercial and industrial embedded applications.
• Manufacturer — Supplied by Microchip Technology.

Typical Applications

• Industrial control and automation — Reconfigurable logic for control algorithms and I/O consolidation in systems that require industrial temperature operation.
• Embedded controllers — Compact FPGA-based controllers where a balance of logic density and on-chip memory simplifies board-level design.
• I/O-rich modules — Systems that need a high number of user I/Os for interfacing sensors, actuators, or external peripherals.

Unique Advantages

• Substantial programmable logic: 13,824 logic elements and 600,000 gates enable implementation of complex state machines and moderate logic functions without external ASICs.
• On-chip memory for local processing: Approximately 0.11 Mbits of embedded RAM reduces dependency on external memory for buffering and small data structures.
• High I/O count: 177 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Compact, surface-mount package: 256-LBGA / 256-FPBGA (17x17) supports space-constrained PCB designs while maintaining solderable surface-mount assembly.
• Industrial temperature capability: Rated from -40 °C to 85 °C for deployment in demanding environmental conditions.
• Low-voltage operation: 1.14 V to 1.575 V supply range allows integration into modern low-voltage system rails.

Why Choose M1AGL600V2-FGG256I?

The M1AGL600V2-FGG256I positions itself as a solid choice for engineers needing a mid-density, industrial-grade FPGA with a compact BGA footprint. Its combination of 13,824 logic elements, substantial gate count, on-chip RAM and 177 I/Os enables consolidation of logic and I/O functions while supporting reliable operation across industrial temperature ranges.

This device is well-suited to embedded and industrial applications that require reconfigurable logic, a high I/O count and a compact surface-mount package. Backed by Microchip Technology, it offers a clear hardware profile for designs that prioritize integration, board-space efficiency and predictable environmental performance.

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