M1AGL600V5-CSG281
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 215 110592 13824 281-TFBGA, CSBGA |
|---|---|
| Quantity | 591 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 281-CSP (10x10) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 281-TFBGA, CSBGA | Number of I/O | 215 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1AGL600V5-CSG281 – IGLOO Field Programmable Gate Array (281-TFBGA, CSBGA)
The M1AGL600V5-CSG281 is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a mid-range programmable logic resource with 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM and 215 general-purpose I/O, all in a compact 281-TFBGA / CSBGA package.
This device targets designs that need a programmable hardware fabric with significant I/O and embedded memory capacity while operating within a commercial temperature range and a tightly specified supply voltage.
Key Features
- Logic Capacity — 13,824 logic elements suitable for implementing moderate-complexity digital logic and custom state machines.
- Embedded Memory — Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for data buffering, FIFOs, and small lookup tables.
- I/O — 215 I/O pins to support multiple interfaces, peripherals and board-level connectivity.
- Gate Count — Approximately 600,000 gates for mapping a broad range of combinational and sequential logic functions.
- Supply Voltage — Specified operating supply range of 1.425 V to 1.575 V for core power planning and regulator selection.
- Package and Mounting — 281-TFBGA, CSBGA package (supplier device package: 281-CSP, 10×10) designed for surface-mount assembly.
- Temperature Grade — Commercial operating temperature range from 0 °C to 70 °C for consumer and general-purpose electronics.
- Compliance — RoHS-compliant construction to meet environmental and regulatory requirements.
Typical Applications
- Embedded Systems — Implement control logic, glue logic and protocol bridging where 13,824 logic elements and plentiful I/O are required.
- Consumer Electronics — Integrate custom interfaces, signal processing blocks and peripheral controllers within consumer-device temperature specifications.
- Prototyping and Development — Rapidly validate hardware architectures and offload critical functions from processors using on-chip logic and memory.
- Communication Interfaces — Manage multiple parallel or serialized interfaces leveraging 215 I/O pins for board-level connectivity and custom timing.
Unique Advantages
- Balanced Logic and Memory: 13,824 logic elements combined with approximately 0.11 Mbits of RAM provide a practical balance for mid-complexity designs without excess overhead.
- High I/O Count: 215 I/O pins enable integration of multiple peripherals and interfaces directly to the FPGA, minimizing external glue logic.
- Compact Surface-Mount Package: The 281-TFBGA / 281-CSP (10×10) package supports dense board layouts while maintaining robust electrical connections.
- Predictable Power Envelope: A defined core supply range (1.425 V–1.575 V) simplifies power supply design and component selection.
- RoHS Compliance: Environmentally compliant materials ease regulatory acceptance for consumer and general-purpose products.
Why Choose M1AGL600V5-CSG281?
The M1AGL600V5-CSG281 positions itself as a practical FPGA choice for engineers needing a mid-range programmable logic device with substantial I/O and embedded memory in a compact surface-mount package. Its defined supply voltage range and commercial temperature rating make it suitable for consumer and general-purpose electronic designs.
This device is well-suited to customers developing prototypes or production hardware that require integration of custom logic, interface aggregation, or moderate signal processing without stepping up to larger FPGA families. The combination of usable logic capacity, embedded RAM and high I/O count delivers a straightforward platform for reducing external components and streamlining board-level design.
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