M1AGL600V2-FGG144I

The M1AGL600V2-FGG144I is an IGLOO low-power flash FPGA from Microchip Technology, delivered in a 144-LBGA (144-FPBGA, 13×13) surface-mount package. This ARM-enabled IGLOO device integrates 13,824 logic elements, approximately 110,592 bits of embedded RAM, and support for the Cortex-M1 soft processor, making it suitable for space-constrained, industrial-grade embedded designs that require low standby power and reprogrammability.

Key Features

• Logic Capacity – 13,824 logic elements and approximately 600,000 system gates to implement mid-density programmable logic and control functions.
• Embedded Memory – 110,592 bits of on-chip true dual-port SRAM for FIFOs, buffers, and microcontroller data storage.
• I/O and Package – 97 user I/Os delivered in a compact 144-LBGA (144-FPBGA, 13×13) surface-mount package for dense board layouts.
• ARM Cortex-M1 Support – M1 IGLOO devices support the 32-bit Cortex-M1 soft processor, enabling embedded firmware and deterministic control within the FPGA fabric.
• Low-Power Modes – Flash*Freeze ultra-low power mode (as little as 5 μW) and Low Power Active (static idle) operation (from 12 μW) to minimize system power in standby and low-activity states.
• Nonvolatile Flash Architecture – Flash-based, reprogrammable technology with instant-on behavior and retention of programmed design when powered off.
• Voltage Range – Core and I/O support for system operation within a 1.14 V to 1.575 V supply range.
• Industrial Temperature Grade – Qualified for operation from −40 °C to 85 °C, suited for industrial environments.
• Security and Programming – In-system programming capabilities are supported; note that ARM-enabled IGLOO devices do not support on-chip 128-bit AES decryption via JTAG.
• Standards and Compliance – RoHS-compliant manufacturing and surface-mount packaging for modern assembly processes.

Typical Applications

• Industrial Control and Automation – Implement custom control logic, motor controllers, or sensor aggregation with sufficient logic capacity and industrial temperature rating.
• Embedded System Controllers – Use the integrated Cortex-M1 soft processor and on-chip RAM for tight integration of firmware and programmable logic in compact products.
• Low-Power Instrumentation – Leverage Flash*Freeze and Low Power Active modes to reduce standby consumption in battery-backed or energy-constrained measurement systems.
• Prototyping and Time-to-Market Designs – Reprogrammable flash architecture provides instant-on behavior and design iteration without external configuration memory.

Unique Advantages

• Ultra-Low Standby Power: Flash*Freeze mode reduces retention power to as little as 5 μW, enabling prolonged standby and reduced energy budgets.
• Integrated Embedded Processing: Cortex-M1 soft processor support enables software-driven control and hybrid hardware/software architectures within the same device.
• Nonvolatile, Instant-On Operation: Flash-based storage retains programmed designs without external configuration, simplifying system boot and reliability.
• Compact, High-Density Package: 144-LBGA footprint with 97 I/Os balances I/O availability and board-area efficiency for compact designs.
• Industrial Temperature and RoHS Compliance: Rated for −40 °C to 85 °C and RoHS-compliant, meeting common industrial assembly and environmental requirements.
• Flexible Power Support: Operates across 1.14 V to 1.575 V supply range to accommodate various low-voltage system topologies.

Why Choose M1AGL600V2-FGG144I?

The M1AGL600V2-FGG144I positions itself as a mid-density, low-power FPGA option where embedded processing, instant-on reprogrammability, and low standby power are important. With 13,824 logic elements, on-chip dual-port RAM, and Cortex-M1 soft processor support, it is tailored for engineers building industrial and embedded controllers that require a compact package and robust power management features.

Its flash-based architecture and industrial temperature rating provide a reliable platform for designs that must retain configuration without external memory and operate across a wide temperature range. The combination of integrated processing, low-power modes, and a compact 144-LBGA footprint helps reduce BOM complexity while maintaining design flexibility.

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