M1AGL600V2-FG256I

IC FPGA 177 I/O 256FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 177 110592 13824 256-LBGA

Quantity 1,221 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O177Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1AGL600V2-FG256I – IGLOO FPGA, 13,824 Logic Elements, 177 I/Os, 256‑LBGA

The M1AGL600V2-FG256I is an IGLOO family flash FPGA IC designed for low-power, single-chip embedded systems. It implements the M1 IGLOO architecture and supports the Cortex‑M1 soft processor, offering a reprogrammable FPGA fabric with nonvolatile flash configuration and ultra-low power modes.

Targeted at industrial applications, this device delivers a balance of logic capacity, embedded memory, and flexible I/O in a compact 256‑LBGA package, while supporting a wide operating voltage range and industrial temperature ratings.

Key Features

  • Logic Capacity — 13,824 logic elements (logic cells) and approximately 600,000 system gates provide mid-range programmable fabric for control, glue-logic and signal-processing tasks.
  • Embedded Memory — 110,592 total RAM bits (approximately 0.11 Mbits) of on-chip memory for data buffering and state retention.
  • I/O and Package — 177 user I/Os in a 256‑LBGA (256‑FPBGA, 17×17) surface‑mount package suited for space‑constrained designs.
  • Low Power Operation — Flash*Freeze ultra‑low power mode (series feature) with device-level support for low power active operation; core supply support from 1.14 V to 1.575 V.
  • Processor Integration — M1 IGLOO devices support the 32‑bit Cortex‑M1 soft processor for embedded control implementation within the FPGA fabric.
  • On‑chip Nonvolatile Flash — Flash-based configuration supports instant-on behavior and reprogrammability while retaining programmed design when powered off.
  • Security Note — As an ARM‑enabled IGLOO device (order number begins with M1AGL), this device does not support on‑chip AES decryption for ISP.
  • Industrial Reliability — Industrial grade with operating temperature range from −40°C to 85°C and RoHS compliance for regulated environments.

Typical Applications

  • Industrial Control — Implement control logic, protocol bridging, and deterministic I/O handling within industrial systems that require extended temperature operation.
  • Low‑Power Embedded Systems — Use Flash*Freeze and low power active modes to build battery‑sensitive or energy‑constrained devices that need retained state and instant availability.
  • Sensor and I/O Hubs — Aggregate and preprocess sensor data with on‑chip RAM and flexible I/O while offloading control tasks to the integrated Cortex‑M1 soft processor.
  • Communications and Protocol Conversion — Implement custom protocol interfaces and data buffering using the available logic elements and embedded memory in a compact footprint.

Unique Advantages

  • Highly integrated single‑chip solution: Flash configuration and embedded memory reduce external components and simplify board-level design.
  • Low‑voltage core support: Core supply from 1.14 V to 1.575 V enables low-power system architectures and compatibility with mixed-voltage I/O banks.
  • Instant‑on, nonvolatile configuration: Flash-based storage retains programmed design when powered off, supporting fast recovery and persistent configurations.
  • Cortex‑M1 soft processor support: Integrate a 32‑bit embedded processor in the FPGA fabric to consolidate control and application logic without external CPUs.
  • Industrial operating range: −40°C to 85°C rating and RoHS compliance for deployment in industrial environments.
  • Compact, board‑friendly package: 256‑LBGA (17×17 FPBGA) surface‑mount package enables high I/O density in constrained form factors.

Why Choose M1AGL600V2-FG256I?

The M1AGL600V2-FG256I positions itself as a low‑power, mid‑capacity FPGA solution for embedded and industrial designs that benefit from on‑chip flash configuration, retained state, and integrated processor capability. With 13,824 logic elements, 110,592 bits of embedded RAM, and 177 I/Os in a 256‑LBGA package, it suits applications that need programmable logic, moderate memory, and flexible I/O while operating across industrial temperature ranges.

Choosing this device supports compact system design, reduced external components, and simplified power management thanks to Flash*Freeze and low power active features—making it a practical option for engineers building reliable, energy‑aware embedded systems.

Request a quote or submit an inquiry to get pricing, availability, and technical support for the M1AGL600V2-FG256I. Our team can help with volume pricing and lead‑time information to support your design timeline.

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