M1AGL600V2-CSG281

IC FPGA 215 I/O 281CSP
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 215 110592 13824 281-TFBGA, CSBGA

Quantity 1,423 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package281-CSP (10x10)GradeCommercialOperating Temperature0°C – 70°C
Package / Case281-TFBGA, CSBGANumber of I/O215Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1AGL600V2-CSG281 – IGLOO Field Programmable Gate Array (FPGA) IC 215 110592 13824 281-TFBGA, CSBGA

The M1AGL600V2-CSG281 is an IGLOO family Field Programmable Gate Array (FPGA) from Microchip Technology, providing programmable logic and embedded resources in a compact CSBGA footprint. It offers 13,824 logic elements, approximately 110,592 bits of on-chip RAM, and 215 general-purpose I/Os to support integration of custom digital functions into electronic systems.

Packaged in a 281-TFBGA (supplier package: 281-CSP 10×10) and specified for commercial-grade operation, this device targets designs that require moderate logic capacity, embedded memory, and a sizeable I/O count within a surface-mount form factor.

Key Features

  • Core Capacity — 13,824 logic elements providing a total of approximately 600,000 gates for implementing custom digital logic and state machines.
  • Embedded Memory — Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for buffering, small data storage, and local state retention.
  • I/O Count — 215 I/Os to support multiple interfaces, sensor connections, and board-level signal routing.
  • Package & Mounting — 281-TFBGA CSBGA package (supplier device package: 281-CSP 10×10) with surface-mount mounting suitable for compact PCB implementations.
  • Power — Operates from a core supply range of 1.14 V to 1.575 V to match system power rails and design constraints.
  • Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 70 °C.
  • Environmental Compliance — RoHS compliant for lead-free assembly processes.

Typical Applications

  • Embedded systems — Implement custom digital logic, finite-state machines, and glue logic directly on board to reduce external components.
  • Interface bridging — Use the device's 215 I/Os to bridge multiple protocols or aggregate signals between subsystems.
  • Signal handling and buffering — Leverage on-chip RAM for temporary data buffering and small-scale packet or frame staging.
  • Prototyping and integration — Compact package and surface-mount mounting make the device suitable for prototype and production PCBs where PCB area is constrained.

Unique Advantages

  • High logic density: 13,824 logic elements and ~600,000 gates enable consolidation of medium-complexity functions into a single device, reducing BOM and board area.
  • On-chip memory availability: Approximately 0.11 Mbits of embedded RAM supports local buffering and state retention without external memory.
  • Large I/O complement: 215 I/Os provide flexibility for connecting sensors, peripherals, and multiple interfaces directly to the FPGA.
  • Compact surface-mount package: 281-TFBGA (281-CSP 10×10) delivers a small footprint suitable for space-constrained designs.
  • Commercial-grade specification: Rated for 0 °C to 70 °C operation to match typical commercial electronic product environments.
  • RoHS compliant: Supports lead-free assembly and regulatory requirements for many markets.

Why Choose M1AGL600V2-CSG281?

The M1AGL600V2-CSG281 combines moderate logic capacity, embedded memory, and a high I/O count in a compact CSBGA package, making it a practical choice for designs that require integrated programmable logic without a large form factor. Its commercial-grade specification and RoHS compliance align with standard production environments.

This device is well suited for engineers and procurement teams seeking a single-chip programmable solution to consolidate glue logic, implement custom interfaces, and provide local buffering, while maintaining a compact PCB footprint and compatibility with surface-mount assembly processes.

Request a quote or submit an inquiry to receive pricing and availability information for M1AGL600V2-CSG281 and to discuss how this FPGA can fit your design requirements.

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