M2GL005S-1FGG484T2

The M2GL005S-1FGG484T2 is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology designed for compact, reliable embedded logic integration. It delivers a balanced combination of logic capacity, on-chip memory, and I/O density in a 484-ball BGA package suitable for space-constrained board designs.

With AEC-Q100 qualification and an extended operating temperature range, this device is targeted at automotive and similarly demanding applications that require robust operation across wide environmental conditions while operating from a low-voltage supply rail.

Key Features

• Logic Capacity Approximately 6060 logic elements provide the programmable fabric needed for custom control, glue logic, and moderate-complexity FPGA tasks.
• Embedded Memory Approximately 0.72 Mbits of on-chip RAM (719,872 total RAM bits) for buffering, small data stores, and state machines.
• High I/O Count 209 general-purpose I/O pins to support multiple interfaces, sensor connections, and external peripheral control.
• Power and Supply Flexibility Operates from a wide voltage supply range of 1.14 V to 2.625 V, enabling use in low-voltage system architectures.
• Automotive Qualification AEC-Q100 qualification for deployment in automotive electronics and other applications that require industry-recognized device qualification.
• Robust Temperature Range Specified for operation from −40°C to 125°C to meet thermal requirements of harsh environments.
• Package and Mounting Surface-mount 484-ball FPBGA (23 × 23) package providing a compact footprint for dense board designs.
• RoHS Compliant Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Automotive Control Systems — AEC-Q100 qualification and wide temperature range make the device suitable for in-vehicle control logic, sensor interfacing, and signal conditioning.
• Embedded Control and Glue Logic — 6060 logic elements and 209 I/Os enable consolidation of discrete controllers and interface logic into a single programmable device.
• Low-Voltage Embedded Designs — Support for 1.14 V to 2.625 V supplies allows integration into modern low-voltage power architectures.
• Space-Constrained PCB Layouts — 484-FPBGA (23 × 23) surface-mount package enables high-density placement in compact electronic assemblies.

Unique Advantages

• Automotive-Ready Qualification: AEC-Q100 qualification and extended temperature rating provide confidence for automotive and harsh-environment deployments.
• Balanced On-Chip Resources: A combination of approximately 6060 logic elements and ~0.72 Mbits of RAM supports a wide range of control and buffering tasks without external memory.
• High I/O Count: 209 I/Os reduce the need for external I/O expanders, simplifying board-level design and lowering BOM complexity.
• Compact Packaging: 484-ball FPBGA in a 23 × 23 footprint enables dense PCB layouts while maintaining robust solder mounting.
• Wide Supply Voltage Range: Flexible input voltage range adapts to varied system power rails and enables use across different platform designs.
• RoHS Compliance: Meets environmental lead-free requirements for modern manufacturing processes.

Why Choose M2GL005S-1FGG484T2?

The M2GL005S-1FGG484T2 positions itself as a reliable, compact FPGA option for designs that require qualified components, broad operating temperatures, and a solid mix of logic, memory, and I/O. Its AEC-Q100 qualification and −40°C to 125°C rating make it suitable for automotive and demanding embedded applications where environmental robustness is important.

Engineers seeking to consolidate control logic, manage multiple interfaces, and maintain a compact board footprint will find this IGLOO2 device aligns with long-term design goals for scalability and robustness while supporting low-voltage system architectures.

Request a quote or submit an inquiry to evaluate the M2GL005S-1FGG484T2 for your next design and to obtain pricing and availability details.