M2GL010-1FG484I

IC FPGA 233 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 233 933888 12084 484-BGA

Quantity 105 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O233Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12084Number of Logic Elements/Cells12084
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits933888

Overview of M2GL010-1FG484I – IGLOO2 Field Programmable Gate Array (FPGA) IC 233 933888 12084 484-BGA

The M2GL010-1FG484I is an IGLOO2 flash-based FPGA from Microchip Technology that integrates fourth‑generation flash FPGA fabric with high‑performance communications and memory interfaces. This device combines low‑power flash architecture, embedded memory and DSP resources to address designs that require secure, reliable programmable logic with flexible I/O and high‑speed serial capability.

Typical use cases include communications and networking modules, DSP/embedded processing subsystems, and industrial control systems where deterministic logic, on‑chip memory and multi‑standard I/O are required.

Key Features

  • Programmable Fabric — Fourth‑generation flash‑based FPGA fabric with efficient 4‑input LUTs and carry chains for performance-oriented logic implementation.
  • Logic Capacity — 12,084 logic elements to implement mid‑density FPGA designs.
  • Embedded Memory — Approximately 0.9 Mbits of on‑chip RAM (933,888 total RAM bits) for data buffering, frame storage and on‑chip working memory.
  • DSP & Math Resources — Family includes embedded mathblock DSP resources to accelerate arithmetic and signal‑processing tasks.
  • High‑Speed Serial Interfaces — IGLOO2 family supports high‑speed SERDES lanes and interfaces such as PCI Express and XAUI/XGMII for networking and link aggregation (family feature).
  • High‑Speed Memory Controllers — Family‑level support for DDRx controllers (DDR2/DDR3/LPDDR) for designs requiring external DRAM interfaces.
  • Flexible I/O and Voltage — 233 user I/Os with support for multi‑standard signaling; device supply range 1.14 V to 2.625 V to accommodate varied I/O and core voltage domains.
  • Security Features — Family includes design and data security capabilities such as encrypted bitstream loading and anti‑tamper mechanisms to protect intellectual property.
  • Package & Mounting — 484‑ball FPBGA (23 × 23) surface‑mount package designed for compact board integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial‑temperature applications.
  • RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.

Typical Applications

  • High‑Speed Communications — Implement protocol bridging, PHY interfaces or lane aggregation using the IGLOO2 family’s SERDES and PCIe capabilities.
  • DSP and Signal Processing — Use embedded mathblocks and on‑chip RAM for real‑time filtering, FFTs and other DSP operations in embedded subsystems.
  • Memory‑Intensive Designs — Drive external DDR2/DDR3 memory through supported memory controllers for frame buffering and large data sets.
  • Industrial Control — Leverage industrial temperature range and programmable logic capacity for motor control, factory automation logic and sensor interfacing.

Unique Advantages

  • Low‑power, flash‑based architecture: Flash configuration provides nonvolatile programmability and lower static power compared to volatile configuration methods.
  • Balanced logic and memory resources: 12,084 logic elements paired with approximately 0.9 Mbits of embedded RAM enable efficient mid‑range designs without frequent external memory access.
  • High‑speed interface capability: Family support for SERDES lanes and PCIe lets designers integrate high‑bandwidth links and networking functionality.
  • Flexible I/O and voltage support: 233 I/Os and a wide supply range (1.14 V–2.625 V) simplify interfacing to varied peripherals and IO standards.
  • Industrial robustness: −40 °C to 100 °C operating range and surface‑mount 484‑FPBGA packaging support ruggedized, space‑efficient designs.
  • Built‑in security features: Encrypted bitstream and anti‑tamper capabilities protect design IP and support deployments in less‑trusted environments.

Why Choose M2GL010-1FG484I?

The M2GL010-1FG484I delivers a practical combination of mid‑range logic density, substantial embedded memory and family‑level high‑speed communications and memory interfaces, making it suitable for designs that require efficient on‑chip resources without large external subsystem complexity. Its flash‑based programmability and security features align with applications that prioritize low‑power configuration retention and protected intellectual property.

Engineers targeting industrial controls, communications endpoints, or DSP‑heavy embedded systems will find the M2GL010‑1FG484I offers a balanced platform for prototyping through production, with industrial temperature capability and a compact 484‑ball FPBGA package for streamlined board integration.

Request a quote or submit an inquiry to evaluate M2GL010-1FG484I for your next design and get pricing and availability information.

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