M2GL010-1FGG484I

IC FPGA 233 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 233 933888 12084 484-BGA

Quantity 306 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O233Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12084Number of Logic Elements/Cells12084
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits933888

Overview of M2GL010-1FGG484I – IGLOO2 FPGA, 12,084 logic elements, ~0.93 Mbits embedded memory, 233 I/Os, 484-BGA

The M2GL010-1FGG484I is a flash-based IGLOO2 Field Programmable Gate Array (FPGA) IC in a 484-BGA package, supplied for industrial applications. Built on the IGLOO2 architecture, the device combines reconfigurable logic, embedded memory, and on-chip system IP to address communications, embedded processing and DSP-oriented designs.

Its architecture emphasizes low power operation, integrated security and a broad set of high-speed interfaces and memory subsystems, making it suitable for systems that require programmable logic with on-chip resources and industrial temperature capability.

Key Features

  • Configurable Logic: 12,084 logic elements in IGLOO2 4-input LUT fabric with carry chains for common combinational and arithmetic functions.
  • Embedded Memory: Approximately 0.93 Mbits of total on-chip RAM (933,888 bits) plus family-level embedded SRAM and nonvolatile memory resources described in the IGLOO2 datasheet.
  • I/O Capacity and Standards: 233 user I/Os supporting multiple I/O standards as supported by the IGLOO2 family, enabling diverse interfacing requirements.
  • High-Speed Interfaces: IGLOO2 family features include native SERDES lanes, PCI Express endpoint capability and high-speed XAUI/XGMII extensions for serial communications (family-level capabilities).
  • DDR Memory Controllers: Family-level high-speed DDRx memory controller support (LPDDR/DDR2/DDR3) with up to 333 MHz clock rate and various bus-width modes.
  • DSP Resources: IGLOO2 architecture provides mathblocks for signed/unsigned multiplication and accumulation for DSP tasks (see family datasheet for available counts and configurations).
  • Power and Supply: Wide supply range from 1.14 V to 2.625 V to support core and I/O domain requirements.
  • Package and Mounting: 484-BGA package, supplier device package 484-FPBGA (23×23), surface-mount mounting type for compact PCB integration.
  • Operational Temperature: Industrial-grade operating range from -40°C to 100°C for deployment in temperature-challenging environments.
  • Security and Reliability: IGLOO2 family security features include encrypted bitstream loading, device certificate support and anti-tamper/zeroization options; higher-level cryptographic services are available on premium family members (refer to family datasheet).

Typical Applications

  • High-Speed Communications: Implement serial protocols and PCIe endpoint interfaces using the IGLOO2 family’s SERDES and PCI Express capabilities for network and telecom modules.
  • Embedded Processing and Control: Integration of logic, embedded RAM and on-chip peripherals for control, protocol bridging and system management in industrial equipment.
  • Memory-Interfacing Systems: Use on-chip memory and the family’s DDRx memory controllers to build buffering and high-bandwidth interfaces between processors and external DRAM.
  • DSP and Signal Processing: Leverage mathblocks and on-chip RAM resources for fixed-point multiply-accumulate and other signal-processing pipelines.

Unique Advantages

  • Integrated Flash-Based Fabric: Flash configuration provides nonvolatile programmability and on-device bitstream storage, simplifying system boot and remote programming models described in the IGLOO2 family materials.
  • Balanced On-Chip Resources: 12,084 logic elements and nearly 0.93 Mbits of on-chip RAM support medium-complexity logic and buffering without immediate dependence on external memory.
  • Flexible I/O and Interface Options: 233 I/Os and family-supported high-speed serial and DDR interfaces enable diverse board-level connectivity and protocol support.
  • Industrial Robustness: Specified industrial operating range (-40°C to 100°C) and surface-mount 484-BGA packaging support deployment in industrial-grade applications.
  • Security-Ready Architecture: Family-level design security and data-security features help protect IP and support secure deployment scenarios.

Why Choose M2GL010-1FGG484I?

The M2GL010-1FGG484I positions IGLOO2 architecture in a package and resource set suited for industrial embedded designs that need a balance of logic, embedded memory and versatile I/O. Its flash-based fabric and family-level subsystem features support designs requiring on-chip security, DSP resources and high-speed memory or serial interfaces.

For engineers and procurement teams building communications modules, embedded controllers or DSP-capable systems, this device provides a compact, industrial-grade FPGA option with a clear set of verifiable specifications for integration and long-term deployment.

Request a quote or submit an RFQ for M2GL010-1FGG484I to receive current pricing and availability information. Include part number and desired quantities to expedite your request.

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