M2GL010-1FGG484T1

IC FPGA 233 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 233 933888 12084 484-BGA

Quantity 1,111 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 135°C
Package / Case484-BGANumber of I/O233Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12084Number of Logic Elements/Cells12084
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits933888

Overview of M2GL010-1FGG484T1 – IGLOO2 Field Programmable Gate Array (FPGA)

The M2GL010-1FGG484T1 is an IGLOO2 family flash-based FPGA device optimized for low-power, high-reliability embedded systems. It combines a 4-input LUT fabric with on-chip memory and high-performance communication interfaces to address designs that require programmable logic, embedded RAM, and flexible I/O.

Targeted for environments that demand extended temperature and automotive qualification, this device supports a broad supply range and a 484-ball BGA package, making it suitable for compact, rugged systems with demanding electrical and thermal requirements.

Key Features

  • Logic Capacity  Provides 12,084 logic elements for implementing custom digital logic and control functions.
  • IGLOO2 Architecture  Leverages IGLOO2’s flash-based 4-input LUT fabric with carry chains for efficient logic implementation and balanced performance versus power.
  • On-Chip Memory  Includes a total of 933,888 bits of on-chip RAM (approximately 0.94 Mbits) for embedded buffering, state storage, and small data structures.
  • High-Performance DSP Support  IGLOO2 family architecture includes mathblocks for DSP workloads (family feature), enabling efficient multiply-accumulate and signal-processing functions.
  • High-Speed Serial and Memory Interfaces (Family Capabilities)  IGLOO2 family supports high-speed SERDES lanes, PCIe endpoint cores, and DDRx memory controllers (LPDDR/DDR2/DDR3), enabling designs that require fast serial links and external DRAM.
  • I/O and Voltage Flexibility  233 user I/Os with multi-standard signaling; supported supply range from 1.14 V to 2.625 V for core and I/O domain flexibility.
  • Clocking Resources (Family Capabilities)  IGLOO2 architecture provides multiple clock sources and up to eight Clock Conditioning Circuits (CCCs) with integrated PLLs for flexible clock generation and distribution.
  • Automotive Qualification  Rated Automotive and qualified to AEC‑Q100, supporting designs that require automotive-grade component qualification.
  • Package and Mounting  Surface-mount 484-ball BGA in a 23 × 23 mm supplier device package, suitable for compact PCB layouts.
  • Extended Temperature Range  Operates from −40 °C to 135 °C for deployment in harsh thermal environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Automotive Systems  Automotive-grade qualification and extended temperature range make this device suitable for vehicle subsystems that require programmable logic, such as sensor fusion, body electronics, and gateway functions.
  • High-Speed Communications  IGLOO2 family support for SERDES lanes and PCIe makes the device applicable to networking and communication endpoints that need custom protocol handling or data-path acceleration.
  • Embedded Memory Interfaces  On-chip RAM plus family DDRx controller capability enable use in designs that implement buffering, memory bridges, or interface logic to external DRAM.
  • Signal Processing  Mathblocks and efficient LUT fabric (family attributes) suit DSP tasks such as filtering, encoding/decoding, and other real-time processing blocks.

Unique Advantages

  • Automotive-Ready Qualification:  AEC‑Q100 qualification and automotive grade labeling simplify selection for vehicle electronics projects requiring qualified components.
  • Compact, High-Density Package:  484-ball FPBGA (23 × 23 mm) provides dense I/O and routing capability in a compact footprint for space-constrained boards.
  • Broad Operating Envelope:  Wide supply range (1.14 V–2.625 V) and −40 °C to 135 °C operation support diverse power architectures and harsh environments.
  • Integrated Memory Resources:  Approximately 0.94 Mbits of on-chip RAM reduces external memory dependency for small buffers and state machines.
  • Flexible I/O and Interface Support:  233 user I/Os with multi-standard signaling and family-level support for high-speed serial and DDR interfaces enable diverse interfacing and system partitioning.

Why Choose M2GL010-1FGG484T1?

The M2GL010-1FGG484T1 pairs the IGLOO2 family’s flash-based FPGA architecture with automotive-grade qualification and a compact BGA package to deliver a reliable, low-power programmable logic option for embedded designs. Its balance of logic capacity, on-chip RAM, and flexible I/O makes it well suited for applications that require deterministic logic control, moderate DSP capability, and robust interfacing in challenging thermal environments.

Designers seeking a qualified FPGA solution for automotive or similarly demanding applications will find this device provides scalable integration and support for common high-speed and memory interfaces through the IGLOO2 architecture, helping reduce system BOM and simplify board-level integration.

If you would like pricing, availability, or a formal quote for the M2GL010-1FGG484T1, please submit a request or inquiry and our team will respond with the next steps.

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