M2GL025-FCSG325

The M2GL025-FCSG325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a moderate logic density FPGA fabric with embedded RAM and a flexible I/O count in a compact surface-mount BGA package.

This device is suited for applications that require reconfigurable digital logic, on-chip memory for buffering, and a substantial number of I/O in a commercial-grade, RoHS-compliant component.

Key Features

• Logic Capacity  27,696 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 1.13 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O  Up to 180 general-purpose I/O pins to consolidate interfaces and connect to peripherals or external logic.
• Power  Operates across a wide supply range from 1.14 V to 2.625 V, enabling flexible system-level power architectures.
• Package & Mounting  325-FCBGA (11×11) / 325-TFBGA surface-mount package for compact board-level integration.
• Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant to meet common environmental requirements.

Typical Applications

• Custom digital logic and control  Implement state machines, protocol handlers, and custom processing using 27,696 logic elements.
• I/O consolidation and interface bridging  Use up to 180 I/O pins to integrate multiple peripherals or bridge disparate interfaces on a single device.
• On-chip buffering and data handling  Leverage approximately 1.13 Mbits of embedded memory for data buffering, FIFOs, or small local storage.

Unique Advantages

• Balanced logic and memory  Combines a substantial logic element count with on-chip RAM to support complex user logic and local data storage without external memory.
• Flexible I/O capacity  A high I/O count simplifies board-level design by reducing the need for additional interface components.
• Wide supply range  Support for 1.14 V to 2.625 V supply voltages lets you align the FPGA with various system power rails.
• Compact, surface-mount package  The 325-FCBGA (11×11) package enables dense board layouts and small form-factor applications.
• Commercial grade and RoHS-compliant  Designed for standard commercial temperature environments and environmental compliance requirements.

Why Choose M2GL025-FCSG325?

The M2GL025-FCSG325 offers a strong combination of logic density, embedded memory, and I/O capability in a compact, surface-mount BGA package. Its voltage flexibility and commercial operating range make it a practical choice for designers needing reconfigurable logic with on-chip buffering and substantial I/O in space-constrained boards.

This part is well suited to development and production designs that require moderate-density programmable logic from a reputable vendor, delivering a balance of integration and board-level simplicity while meeting common environmental compliance expectations.

Request a quote for M2GL025-FCSG325 to discuss pricing and availability for your next design.