M2GL025-FCS325I

The M2GL025-FCS325I is an IGLOO2 family Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It provides a mid-range logic capacity with 27,696 logic elements and approximately 1.13 Mbits of embedded memory to support control, interfacing and configurable logic tasks.

With 180 user I/Os, a wide supply voltage window (1.14 V to 2.625 V), surface-mount 325-FCBGA packaging, and an operating temperature range of −40 °C to 100 °C, the device targets designs that require robust I/O and industrial temperature capability in a compact BGA footprint.

Key Features

• Logic Capacity  27,696 logic elements for configurable logic implementation and mid-density FPGA designs.
• Embedded Memory  Approximately 1.13 Mbits of on-chip RAM to support data buffering, state machines and small memory-intensive functions.
• I/O  180 available I/O pins to support multiple interfaces, sensor aggregation, and parallel control signals.
• Power  Flexible supply range from 1.14 V to 2.625 V to accommodate various low-voltage system rails and power domains.
• Package & Mounting  325-FCBGA (11×11) / 325-TFBGA package in a surface-mount form factor for compact PCB integration.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant for environmental regulatory alignment.

Typical Applications

• Industrial Control  Use in control modules and automation equipment that require industrial temperature capability and flexible I/O connectivity.
• I/O Aggregation and Bridging  Consolidate multiple sensor or peripheral interfaces using the device’s 180 I/O pins and embedded memory for local buffering and control logic.
• Embedded Processing Modules  Integrate configurable logic and RAM capacity for custom datapath, timing, or glue-logic functions in embedded systems designed for harsh environments.

Unique Advantages

• Industrial-grade operation: The −40 °C to 100 °C operating range and industrial grade designation make the device suitable for temperature-critical deployments.
• Balanced logic and memory: 27,696 logic elements paired with approximately 1.13 Mbits of embedded RAM provide a practical balance for control and interfacing tasks without excessive overcapacity.
• High I/O count: 180 I/Os allow flexible partitioning of signals, enabling multi-channel interfaces and board-level consolidation.
• Flexible power rails: A wide supply voltage window (1.14 V–2.625 V) supports integration into systems with different low-voltage domains.
• Compact BGA packaging: The 325-FCBGA (11×11) surface-mount package enables dense PCB layouts while providing a reliable ball-grid mounting solution.
• RoHS compliant: Environmentally compliant manufacturing and disposal alignment for regulated markets.

Why Choose M2GL025-FCS325I?

The M2GL025-FCS325I positions itself as a practical IGLOO2 FPGA option when designers need a mid-density logic device with substantial I/O, embedded memory, and industrial operating capability. Its combination of 27,696 logic elements, approximately 1.13 Mbits of RAM, and 180 I/Os suits designs focused on control, interfacing, and I/O-centric functions in industrial environments.

Manufactured by Microchip Technology and delivered in a compact 325-FCBGA surface-mount package, this device offers a straightforward integration path for teams seeking robust temperature performance, flexible voltage operation, and a balanced feature set for long-lived embedded and industrial designs.

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