M2GL025-1VFG256I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 138 1130496 27696 256-LFBGA |
|---|---|
| Quantity | 606 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 138 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 27696 | Number of Logic Elements/Cells | 27696 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1130496 |
Overview of M2GL025-1VFG256I – IGLOO2 Field Programmable Gate Array (FPGA) IC 138 1130496 27696 256-LFBGA
The M2GL025-1VFG256I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a programmable logic fabric with a substantial number of logic elements and embedded RAM, packaged for surface-mount assembly.
Engineered for industrial applications, the device combines 27,696 logic elements, approximately 1.13 Mbits of on-chip RAM, and 138 I/O to address compact, high-density programmable logic requirements while supporting a wide operating temperature range and flexible supply voltages.
Key Features
- Logic Capacity 27,696 logic elements to implement complex combinational and sequential logic designs.
- Embedded Memory Approximately 1.13 Mbits of on-chip RAM (1,130,496 bits) for data buffering, state storage, and local memory needs.
- I/O Resources 138 I/O pins to support multiple external interfaces and peripheral connections.
- Voltage Supply Range Operates from 1.14 V to 2.625 V, providing flexibility for different power-domain designs.
- Package & Mounting 256-LFBGA package; supplier device package listed as 256-FPBGA (14×14). Surface-mount mounting for PCB assembly.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C and designated as Industrial grade.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Industrial Control Programmable logic and I/O count support custom control algorithms and interface consolidation in industrial automation equipment.
- Embedded Processing On-chip RAM and sizable logic capacity enable feature integration for embedded processing and finite-state machines.
- I/O Expansion & Protocol Bridging High I/O count and flexible voltage operation allow implementation of protocol bridges and I/O-conditioning logic.
Unique Advantages
- Substantial Logic Density: 27,696 logic elements provide the capacity to implement complex logic functions within a single device, reducing board-level component count.
- On-Chip Memory: Approximately 1.13 Mbits of embedded RAM supports local buffering and state retention without external memory.
- Flexible I/O: 138 I/Os enable multiple peripheral and interface connections from one package, simplifying system partitioning.
- Wide Voltage Support: Support for 1.14 V to 2.625 V supply rails offers adaptability to different system power domains.
- Industrial Rating: Industrial-grade temperature range (−40 °C to 100 °C) suits deployments in demanding environments.
- Surface-Mount BGA Packaging: 256-LFBGA / 256-FPBGA (14×14) packaging balances PCB footprint and thermal/mechanical integration for production assembly.
Why Choose M2GL025-1VFG256I?
The M2GL025-1VFG256I positions itself for designs that require a combination of high logic capacity, embedded memory, and a broad set of I/O options in an industrial-grade FPGA. Its voltage flexibility and surface-mount BGA package make it suitable for compact, production-ready boards operating across a wide temperature range.
This device is appropriate for engineers and procurement teams targeting integrated programmable logic solutions where on-chip resources and industrial operating characteristics are key selection criteria. Its specification set supports consolidation of discrete logic and local memory into a single, RoHS-compliant component.
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