XC7A35T-1CSG325I

IC FPGA 150 I/O 324CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 150 1843200 33280 324-LFBGA, CSPBGA

Quantity 392 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O150Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2600Number of Logic Elements/Cells33280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1843200

Overview of XC7A35T-1CSG325I – Artix-7 Field Programmable Gate Array (FPGA)

The XC7A35T-1CSG325I is an Artix-7 Field Programmable Gate Array (FPGA) packaged in a 324-pin LFBGA (CSPBGA) footprint. It provides a balance of programmable logic capacity, embedded memory, and a broad I/O count in an industrial-grade, surface-mount package.

With 33,280 logic elements, approximately 1.84 Mbits of embedded memory, and 150 I/O pins, this device is intended for designs that require configurable digital logic, on-chip RAM, and operation across an industrial temperature range while maintaining compact packaging and controlled supply voltage requirements.

Key Features

  • Logic Capacity 33,280 logic elements provide a sizable fabric for implementing custom digital functions and finite-state machines within a single-chip solution.
  • Embedded Memory Approximately 1.84 Mbits of on-chip RAM support buffering, FIFOs, and small data storage close to logic for reduced latency and simplified board-level memory requirements.
  • I/O and Packaging 150 I/O pins in a 324-LFBGA (324-CSPBGA, 15×15) surface-mount package enable dense board integration and flexible peripheral connectivity while supporting compact system layouts.
  • Power Supply Core voltage operation specified from 950 mV to 1.05 V, enabling predictable power budgeting for system power-rail design.
  • Industrial Temperature Range Rated for operation from -40 °C to 100 °C, suitable for deployment in environments requiring extended temperature tolerance.
  • Compliance RoHS-compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

  • Industrial Control Implement custom logic for motion control, deterministic I/O handling, and sequencing with operation across the specified industrial temperature range.
  • Embedded Processing and Glue Logic Offload protocol bridging, bus interfacing, and control functions using the device's logic capacity and on-chip RAM to reduce external components.
  • Data Acquisition and Signal Conditioning Use on-chip memory and extensive I/O to buffer and preprocess sensor or measurement data before passing it to a host processor.

Unique Advantages

  • Balanced Logic and Memory Combines 33,280 logic elements with approximately 1.84 Mbits of embedded RAM to support integrated digital processing and temporary data storage on a single device.
  • High I/O Count in Compact Package 150 I/Os in a 324-LFBGA (15×15 CSPBGA) package allow dense connectivity without requiring a larger board footprint.
  • Industrial Temperature Rating Rated from -40 °C to 100 °C for applications that must tolerate wide temperature swings in deployed environments.
  • Controlled Core Voltage Range Core supply specified from 950 mV to 1.05 V simplifies power-rail planning and integration with regulated power supplies.
  • RoHS Compliance Supports lead-free manufacturing processes and regulatory compliance across production workflows.

Why Choose XC7A35T-1CSG325I?

The XC7A35T-1CSG325I positions itself as a compact, industrial-grade FPGA choice where a combination of moderate logic capacity, embedded RAM, and a generous I/O count are required. Its LFBGA/CSPBGA packaging and surface-mount mounting type make it suitable for space-conscious designs while its supply voltage and operating temperature specifications enable predictable integration into controlled power and environmental designs.

This device is a practical option for engineers building configurable digital subsystems that need on-chip memory, extensive I/O, and industrial temperature performance backed by RoHS compliance. It supports scalable development within systems that prioritize integration and thermal resilience.

Request a quote or submit a purchase inquiry to get pricing and lead-time information for the XC7A35T-1CSG325I. Our team will respond with the details needed to move your design forward.

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