XC7A35T-1CSG325I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 150 1843200 33280 324-LFBGA, CSPBGA |
|---|---|
| Quantity | 392 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSPBGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA, CSPBGA | Number of I/O | 150 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2600 | Number of Logic Elements/Cells | 33280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1843200 |
Overview of XC7A35T-1CSG325I – Artix-7 Field Programmable Gate Array (FPGA)
The XC7A35T-1CSG325I is an Artix-7 Field Programmable Gate Array (FPGA) packaged in a 324-pin LFBGA (CSPBGA) footprint. It provides a balance of programmable logic capacity, embedded memory, and a broad I/O count in an industrial-grade, surface-mount package.
With 33,280 logic elements, approximately 1.84 Mbits of embedded memory, and 150 I/O pins, this device is intended for designs that require configurable digital logic, on-chip RAM, and operation across an industrial temperature range while maintaining compact packaging and controlled supply voltage requirements.
Key Features
- Logic Capacity 33,280 logic elements provide a sizable fabric for implementing custom digital functions and finite-state machines within a single-chip solution.
- Embedded Memory Approximately 1.84 Mbits of on-chip RAM support buffering, FIFOs, and small data storage close to logic for reduced latency and simplified board-level memory requirements.
- I/O and Packaging 150 I/O pins in a 324-LFBGA (324-CSPBGA, 15×15) surface-mount package enable dense board integration and flexible peripheral connectivity while supporting compact system layouts.
- Power Supply Core voltage operation specified from 950 mV to 1.05 V, enabling predictable power budgeting for system power-rail design.
- Industrial Temperature Range Rated for operation from -40 °C to 100 °C, suitable for deployment in environments requiring extended temperature tolerance.
- Compliance RoHS-compliant, supporting regulatory requirements for lead-free manufacturing.
Typical Applications
- Industrial Control Implement custom logic for motion control, deterministic I/O handling, and sequencing with operation across the specified industrial temperature range.
- Embedded Processing and Glue Logic Offload protocol bridging, bus interfacing, and control functions using the device's logic capacity and on-chip RAM to reduce external components.
- Data Acquisition and Signal Conditioning Use on-chip memory and extensive I/O to buffer and preprocess sensor or measurement data before passing it to a host processor.
Unique Advantages
- Balanced Logic and Memory Combines 33,280 logic elements with approximately 1.84 Mbits of embedded RAM to support integrated digital processing and temporary data storage on a single device.
- High I/O Count in Compact Package 150 I/Os in a 324-LFBGA (15×15 CSPBGA) package allow dense connectivity without requiring a larger board footprint.
- Industrial Temperature Rating Rated from -40 °C to 100 °C for applications that must tolerate wide temperature swings in deployed environments.
- Controlled Core Voltage Range Core supply specified from 950 mV to 1.05 V simplifies power-rail planning and integration with regulated power supplies.
- RoHS Compliance Supports lead-free manufacturing processes and regulatory compliance across production workflows.
Why Choose XC7A35T-1CSG325I?
The XC7A35T-1CSG325I positions itself as a compact, industrial-grade FPGA choice where a combination of moderate logic capacity, embedded RAM, and a generous I/O count are required. Its LFBGA/CSPBGA packaging and surface-mount mounting type make it suitable for space-conscious designs while its supply voltage and operating temperature specifications enable predictable integration into controlled power and environmental designs.
This device is a practical option for engineers building configurable digital subsystems that need on-chip memory, extensive I/O, and industrial temperature performance backed by RoHS compliance. It supports scalable development within systems that prioritize integration and thermal resilience.
Request a quote or submit a purchase inquiry to get pricing and lead-time information for the XC7A35T-1CSG325I. Our team will respond with the details needed to move your design forward.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








