XC7A35T-1FGG484I

The XC7A35T-1FGG484I is an Artix‑7 Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 484‑ball BGA package. It combines mid‑range logic capacity with substantial on‑chip memory and a high I/O count for integration into industrial designs.

With a core supply range of 0.95 V to 1.05 V and an operating temperature range of −40 °C to 100 °C, this device targets applications that require reliable operation across a broad temperature span and flexible I/O and memory resources.

Key Features

• Logic Capacity  Approximately 33,280 logic elements, providing mid‑range programmable logic resources for custom digital functions.
• Embedded Memory  Approximately 1.84 Mbits of on‑chip RAM to support buffering, FIFOs, and small data stores without external memory.
• I/O Resources  Up to 250 I/O pins, enabling connectivity to a wide range of peripherals and interfaces.
• Package & Mounting  484‑BBGA package (supplier package 484‑FBGA, 23 × 23 mm) designed for surface‑mount assembly.
• Power  Core voltage supply specified from 0.95 V to 1.05 V for the device core power domain.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
• RoHS Compliance  RoHS‑compliant construction to meet environmental and regulatory requirements.

Typical Applications

• Industrial Control  Suitable for control logic and I/O aggregation where industrial temperature operation and flexible I/O counts are required.
• Data Buffering and Pre‑Processing  On‑chip memory (approximately 1.84 Mbits) supports local buffering and real‑time data handling before transfer to downstream systems.
• Protocol Bridging and Interface Logic  High I/O count enables implementation of custom protocol translators and interface glue logic in embedded systems.

Unique Advantages

• Balanced Logic and Memory: The combination of ~33,280 logic elements and ~1.84 Mbits of embedded RAM supports mid‑range designs that require both logic density and local storage.
• High I/O Availability: With up to 250 I/O pins, the FPGA can connect to multiple peripherals and sensors without immediate need for external multiplexing.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, enabling deployment in thermally demanding industrial environments.
• Compact Surface‑Mount Package: The 484‑ball BGA (23 × 23 mm) offers a compact form factor for space‑constrained PCB designs while providing a large I/O count.
• Regulatory Compliance: RoHS compliance supports use in modern manufacturing and supply chains that require restricted‑substance conformance.

Why Choose XC7A35T-1FGG484I?

The XC7A35T‑1FGG484I positions itself as a mid‑range Artix‑7 FPGA option that blends a substantive logic element count with on‑chip memory and extensive I/O in a compact BGA package. Its industrial temperature rating and defined core voltage range make it a practical choice for embedded designs that must operate reliably across wide temperature variations.

This device is suited to engineers and procurement teams designing systems that need scalable programmable logic, local memory resources for real‑time tasks, and ample physical I/O while maintaining RoHS compliance and a small footprint.

Request a quote or submit an inquiry to receive pricing and availability for the XC7A35T‑1FGG484I for your next design.