XC7A35T-1FTG256I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 170 1843200 33280 256-LBGA |
|---|---|
| Quantity | 532 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 170 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2600 | Number of Logic Elements/Cells | 33280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1843200 |
Overview of XC7A35T-1FTG256I – Artix-7 FPGA, 256-LBGA
The XC7A35T-1FTG256I is an Artix-7 field programmable gate array (FPGA) IC provided in a 256-LBGA package. It combines a balanced set of configurable logic resources, embedded RAM and a substantial I/O count, aimed at industrial designs that require wide operating temperature capability and surface-mount packaging.
Key characteristics include 2,600 configurable logic blocks, approximately 1.84 Mbits of embedded memory, 170 I/O pins and a core voltage supply range of 0.95 V to 1.05 V, enabling compact, low-voltage FPGA implementations for industrial applications.
Key Features
- Logic Capacity 2,600 configurable logic blocks (CLBs) supporting a total of 33,280 logic cells for implementing custom digital logic and state machines.
- On-chip Memory Approximately 1.84 Mbits of embedded RAM to support data buffering, FIFOs and small local memories without external RAM.
- I/O Count 170 I/O pins suitable for interfacing multiple peripherals, sensors and external devices.
- Power Core voltage supply range from 0.95 V to 1.05 V to match low-voltage system requirements.
- Package 256-LBGA package (supplier device package: 256-FTBGA, 17 × 17) in a surface-mount form factor for compact board layouts.
- Temperature Range Industrial operating range from −40°C to 100°C for deployment in temperature-challenging environments.
- Compliance RoHS-compliant for environmental regulatory alignment.
Typical Applications
- Industrial Automation Use for control logic, sensor interfacing and deterministic I/O handling in industrial systems that require an extended temperature range.
- Embedded Systems Integration of custom processing, protocol bridging and peripheral aggregation where embedded RAM and a moderate logic count are needed.
- Communications Interfaces Implementation of custom I/O protocols, data buffering and signal conditioning across multiple external interfaces.
Unique Advantages
- Balanced Logic and Memory: 33,280 logic cells combined with approximately 1.84 Mbits of on-chip RAM enable integration of control, buffering and sequencing without excessive external components.
- High I/O Density: 170 I/O pins provide flexibility for connecting multiple peripherals, sensors and interface transceivers.
- Industrial Temperature Rating: Rated from −40°C to 100°C for reliable operation in temperature-stressed installations.
- Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17 × 17) supports space-constrained PCB designs while maintaining routing density.
- Low-Voltage Core: Core supply range of 0.95 V to 1.05 V supports modern low-voltage system architectures.
- RoHS Compliant: Environmentally compliant for designs that require restricted substance adherence.
Why Choose XC7A35T-1FTG256I?
The XC7A35T-1FTG256I offers a practical combination of logic resources, embedded memory and a large I/O complement in a compact surface-mount LBGA package tailored for industrial deployments. Its specified core voltage range and extended operating temperature make it suitable for engineers seeking a reliable FPGA building block for embedded control, interface bridging and I/O-intensive designs.
This device is suited to teams that need scalable, field-programmable logic with on-chip memory and strong I/O capability while maintaining a small PCB footprint and compliance with RoHS requirements.
Request a quote or submit an inquiry to obtain pricing, lead times and availability for the XC7A35T-1FTG256I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








