XC7A35T-2CPG236I

IC FPGA 106 I/O 238CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 106 1843200 33280 238-LFBGA, CSPBGA

Quantity 1,296 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package238-CSBGA (10x10)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case238-LFBGA, CSPBGANumber of I/O106Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2600Number of Logic Elements/Cells33280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1843200

Overview of XC7A35T-2CPG236I – Artix-7 FPGA, 106 I/O, ~1.84 Mbits RAM, 33,280 logic elements

The XC7A35T-2CPG236I is an Artix‑7 Field Programmable Gate Array (FPGA) IC providing a balance of on‑chip logic capacity, embedded memory, and I/O in a BGA package. It is an industrial‑grade, surface‑mount FPGA with a specified operating temperature range and low‑voltage core supply.

This device is appropriate for designs that require a mix of logic density, embedded memory (approximately 1.84 Mbits), and up to 106 general‑purpose I/O, while meeting industrial temperature and RoHS compliance requirements.

Key Features

  • Core Logic  33,280 logic elements provide programmable logic resources for custom digital functions and accelerators.
  • Embedded Memory  Approximately 1.84 Mbits of on‑chip RAM for buffering, state storage, and memory‑mapped logic needs.
  • I/O Capacity  106 available I/O pins suitable for interfacing with peripherals, sensors, and external memory devices.
  • Power  Core supply voltage range of 950 mV to 1.05 V to match system power rail planning and low‑voltage designs.
  • Package and Mounting  238‑LFBGA / CSPBGA package; supplier device package noted as 238‑CSBGA (10×10). Surface‑mount device suitable for board‑level integration.
  • Operating Range & Reliability  Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental standards.

Typical Applications

  • Industrial Control  Industrial‑grade temperature range and flexible I/O make this FPGA suitable for control logic, protocol bridging, and real‑time interfacing in industrial equipment.
  • Embedded Processing  On‑chip memory and substantial logic element count support custom accelerators, glue logic, and embedded data path functions.
  • Interface and I/O Aggregation  With 106 I/O, the device can consolidate multiple peripheral interfaces and manage board‑level signal routing and timing.

Unique Advantages

  • Industrial‑Grade Operation:  Specified −40 °C to 100 °C operating range supports deployments in harsh or temperature‑variable environments.
  • Balanced Logic and Memory:  33,280 logic elements paired with approximately 1.84 Mbits of embedded RAM enables mid‑range programmable designs without external memory in many cases.
  • Compact, High‑Pin‑Count Package:  238‑LFBGA / 238‑CSBGA (10×10) delivers high I/O density in a surface‑mount BGA footprint for space‑constrained boards.
  • Low‑Voltage Core Compatibility:  Core voltage range of 950 mV to 1.05 V supports integration with modern low‑voltage power architectures.
  • Regulatory Compliance:  RoHS compliant for environmental requirements in supply chains and manufacturing.

Why Choose XC7A35T-2CPG236I?

The XC7A35T-2CPG236I positions itself as an industrial‑grade Artix‑7 FPGA that combines a substantial logic element count with embedded memory and a practical I/O complement, all in a compact BGA package. Its specified voltage and temperature ranges, together with RoHS compliance, make it a clear choice for designers needing a reliable, integrable programmable logic device for embedded and control applications.

Choose this part when you need an FPGA that provides mid‑range programmable resources, predictable thermal and power characteristics, and the board‑level density afforded by a 238‑ball BGA package.

Request a quote or submit a purchase inquiry to obtain pricing, lead time, and availability for the XC7A35T-2CPG236I.

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