XC7A35T-2CSG325I

The XC7A35T-2CSG325I is an Artix-7 field programmable gate array (FPGA) IC from AMD. It integrates 33,280 logic elements and approximately 1.84 Mbits of embedded memory, delivering a balanced combination of logic capacity and on‑chip RAM for compact system designs.

With 150 I/Os, a compact 324‑LFBGA (324‑CSPBGA 15×15) package, an industrial operating temperature range (−40 °C to 100 °C), and a core supply range of 950 mV to 1.05 V, this device is specified for industrial applications that require surface‑mount assembly and robust thermal tolerance.

Key Features

• Core Logic  33,280 logic elements provide a solid logic fabric for implementing custom digital functions, control logic, and moderate-scale datapaths.
• Embedded Memory  Approximately 1.84 Mbits of on‑chip RAM to support buffering, LUTs, and state storage without external memory for many use cases.
• I/O Density  150 general-purpose I/Os accommodate multiple peripheral interfaces and sensor or actuator connections in a single device.
• Package & Mounting  324‑LFBGA (supplier package: 324‑CSPBGA 15×15) in a surface‑mount form factor for compact PCB layouts and automated assembly.
• Power  Core voltage supply range of 950 mV to 1.05 V to match system power rails and design constraints.
• Operating Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C, suitable for equipment deployed in demanding thermal environments.
• Compliance  RoHS compliant for environmental and regulatory alignment in manufacturing.

Typical Applications

• Industrial Control  Leverages industrial temperature rating and robust I/O count for control logic, motor drives, and factory automation modules.
• Embedded Processing  On‑chip logic and embedded memory support custom protocol handling, preprocessing, and glue logic in embedded systems.
• Sensor & Peripheral Interfaces  150 I/Os enable consolidation of sensor interfaces, ADC/DAC control, and peripheral aggregation on a single FPGA.
• Communications Bridging  Logic capacity and I/O density allow implementation of bridging and protocol translation functions between subsystems.

Unique Advantages

• Balanced logic and memory: 33,280 logic elements combined with ~1.84 Mbits of embedded RAM supports a wide range of mid‑scale digital designs without requiring extensive external memory.
• High I/O integration: 150 I/Os reduce the need for external multiplexers or GPIO expanders, simplifying PCB routing and lowering BOM complexity.
• Industrial readiness: Specified for −40 °C to 100 °C operation and marked as industrial grade, enabling deployment in temperature‑challenging environments.
• Compact surface‑mount package: 324‑LFBGA (15×15 CSPBGA) allows dense PCB integration and supports automated surface‑mount assembly processes.
• Controlled supply range: Core voltage specification of 950 mV to 1.05 V provides clear power requirements for system power budgeting and regulator selection.
• Regulatory alignment: RoHS compliance supports environmental requirements for manufacturing and product distribution.

Why Choose XC7A35T-2CSG325I?

The XC7A35T-2CSG325I positions itself as a practical Artix‑7 FPGA option for engineers seeking a mid‑capacity, industrial‑rated programmable device. Its combination of 33,280 logic elements, approximately 1.84 Mbits of embedded RAM, and 150 I/Os in a compact 324‑LFBGA package offers a strong balance of integration, I/O flexibility, and thermal tolerance for industrial and embedded applications.

Manufactured by AMD and supplied in a surface‑mount CSPBGA footprint, this device is intended for designs that require reliable performance across a broad temperature range, clear power supply requirements, and RoHS compliance for streamlined manufacturing and procurement.

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