XC7A35T-2CSG324I

The XC7A35T-2CSG324I is an Artix‑7 FPGA from AMD providing 33,280 logic elements and approximately 1.84 Mbits of embedded memory in a 324‑ball CSPBGA/LFBGA package. Its feature set and I/O density are delivered in a surface‑mount 324‑CSPBGA (15×15) package designed for industrial temperature operation.

This device is specified with a core voltage range of 950 mV to 1.05 V, supports up to 210 I/O pins, and is RoHS compliant—making it suitable for designs that require substantial programmable logic, on‑chip memory, and a wide operating temperature window.

Key Features

• Logic Capacity — 33,280 logic elements provide a substantial programmable fabric for implementing custom digital functions and accelerators.
• Embedded Memory — Approximately 1.84 Mbits of on‑chip RAM for buffering, FIFOs, and small data storage close to logic.
• I/O Density — Up to 210 I/O pins to support a range of peripheral interfaces and board-level connectivity.
• Package and Mounting — 324‑LFBGA / 324‑CSPBGA (15×15) surface‑mount package suitable for compact PCB designs.
• Power — Core voltage specified from 950 mV to 1.05 V for integration with modern power architectures.
• Operating Range and Grade — Industrial grade device rated for operation from −40 °C to 100 °C; RoHS compliant.

Unique Advantages

• High programmable logic density: 33,280 logic elements allow implementation of complex logic functions without external ASICs or controllers.
• On‑chip memory resources: Approximately 1.84 Mbits of embedded RAM reduce dependence on external memory for buffering and local storage.
• Generous I/O count: 210 I/Os enable integration with multiple peripherals and parallel interfaces directly on the FPGA.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation across a wide range of environments.
• Compact surface‑mount package: 324‑CSPBGA (15×15) offers a space‑efficient footprint for high‑density board designs.
• RoHS compliant: Meets environmental compliance requirements for modern electronic assemblies.

Why Choose XC7A35T-2CSG324I?

The XC7A35T-2CSG324I combines substantial logic capacity, on‑chip memory, and a high I/O count in a compact, industrial‑rated package. It is positioned for designs that require integrated programmable logic and memory with the robustness of industrial temperature operation.

For engineers and procurement teams seeking a scalable FPGA option with clear, verifiable specifications—logic elements, embedded RAM, I/O count, package, voltage, and temperature rating—this device offers a balance of integration and specification transparency to support medium‑to‑complex FPGA implementations.

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