XC7A35T-2FGG484C

The XC7A35T-2FGG484C is an Artix‑7 Field Programmable Gate Array (FPGA) IC from AMD. It delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 484‑BBGA package for commercial‑grade electronic designs.

Designed for applications that require programmable digital logic, substantial on‑chip RAM, and a high number of general‑purpose I/O, this device provides a clear resource set for system integration while meeting standard commercial temperature and RoHS requirements.

Key Features

• Core Logic — 33,280 logic elements to implement custom digital functions and control logic.
• Embedded Memory — Approximately 1.84 Mbits of on‑chip RAM (1,843,200 bits) for buffering, state storage, and intermediate data processing.
• I/O Density — 250 user I/O pins to support multiple parallel interfaces, signal routing, and peripheral connectivity.
• Power Supply — Core voltage supply range 0.950 V to 1.05 V, enabling precise power budgeting for system designs.
• Package & Mounting — 484‑BBGA (supplier package: 484‑FBGA, 23 × 23) in a surface‑mount form factor for compact PCB layouts.
• Operating Range & Grade — Commercial grade with operating temperature range 0 °C to 85 °C.
• Compliance — RoHS‑compliant for environmentally regulated assemblies.

Typical Applications

• Custom digital logic & prototyping — Implement and iterate custom state machines, signal processing blocks, and hardware accelerators using the device’s sizable logic array and embedded memory.
• High‑density I/O consolidation — Consolidate multiple interfaces and peripheral connections on a single device thanks to 250 available I/O pins.
• On‑chip buffering and data handling — Use approximately 1.84 Mbits of embedded RAM for packet buffering, frame storage, or intermediate computation in streaming applications.

Unique Advantages

• Balanced resource mix: 33,280 logic elements combined with on‑chip RAM deliver a versatile platform for a wide range of digital designs without external logic blocks.
• High I/O count: 250 user I/O pins simplify board-level integration by reducing the need for external multiplexers or GPIO expanders.
• Compact implementation: 484‑BBGA surface‑mount package enables dense PCB layouts while preserving a large resource set.
• Predictable power profile: Defined core voltage range (0.950–1.05 V) aids power supply design and thermal planning.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS‑compliant, suitable for mainstream commercial products and prototypes.

Why Choose XC7A35T-2FGG484C?

The XC7A35T-2FGG484C positions itself as a practical, commercially rated FPGA option that combines moderate logic density, substantial embedded memory, and a high I/O count in a compact FBGA package. Its specification set supports designs that require programmable hardware resources and flexible interface integration while keeping board area and component count under control.

Manufactured by AMD and provided in a RoHS‑compliant surface‑mount package with a defined operating range, this device offers a predictable platform for teams developing commercial electronic products, prototypes, and custom logic solutions that benefit from integrated memory and abundant I/O.

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