XC7A35T-2FTG256C

IC FPGA 170 I/O 256FTBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 170 1843200 33280 256-LBGA

Quantity 1,596 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O170Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2600Number of Logic Elements/Cells33280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1843200

Overview of XC7A35T-2FTG256C – Artix-7 FPGA, 33,280 logic elements, 256‑LBGA

The XC7A35T-2FTG256C is an Artix‑7 field programmable gate array in a 256‑ball L‑BGA package designed for surface‑mount assembly. It provides 33,280 logic elements and approximately 1.84 Mbits of on‑chip RAM for mid‑range programmable logic implementations.

With 170 user I/O pins, a 0.95 V to 1.05 V supply range, and commercial operating temperatures from 0 °C to 85 °C, this device is suited for designs that require a balance of logic capacity, embedded memory, and flexible I/O in a compact 256‑FTBGA (17×17) footprint. The device is RoHS compliant.

Key Features

  • Logic Capacity  Provides 33,280 logic elements suitable for mid‑range FPGA designs requiring significant programmable logic resources.
  • Embedded Memory  Approximately 1.84 Mbits of on‑chip RAM to support data buffering, state machines, and small on‑chip storage needs.
  • I/O  170 user I/O pins to support multiple external interfaces and board‑level connectivity options.
  • Power  Core supply range from 950 mV to 1.05 V, enabling designs that adhere to specified voltage rails for the device.
  • Package & Mounting  256‑LBGA package (supplier device package: 256‑FTBGA, 17×17) intended for surface‑mount PCB assembly.
  • Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
  • Compliance  RoHS compliant to support lead‑free manufacturing requirements.

Unique Advantages

  • Substantial logic density: 33,280 logic elements provide the headroom for complex finite state machines, glue logic, and custom datapaths without external PLD count increases.
  • On‑chip memory availability: Approximately 1.84 Mbits of embedded RAM reduces the need for external memory for moderate buffering and packet/queue storage.
  • Flexible I/O count: 170 I/O pins enable integration of multiple peripherals and interfaces on a single device footprint.
  • Compact package: 256‑FTBGA (17×17) supports space-constrained board layouts while retaining substantial I/O and logic resources.
  • Commercial temperature rating: Rated 0 °C to 85 °C for designs targeting standard commercial environments.
  • RoHS compliant: Suitable for lead‑free assembly and regulatory environments requiring RoHS adherence.

Why Choose XC7A35T-2FTG256C?

The XC7A35T-2FTG256C positions itself as a mid‑range Artix‑7 FPGA that combines a meaningful logic element count, embedded memory, and a high pin count in a compact 256‑LBGA package. Its electrical and thermal specifications—0.95–1.05 V core supply and 0 °C–85 °C operating range—make it appropriate for commercial designs that need programmable logic density and on‑chip RAM without moving to larger packages.

This device is well suited to engineering teams and procurement groups seeking a RoHS‑compliant, surface‑mount FPGA solution with balanced resources for prototyping, control logic, interface aggregation, and other mid‑complexity digital functions. Its footprint and pin count support consolidation of multiple board functions into a single programmable device, helping manage BOM complexity and design iteration.

Request a quote or submit a purchase inquiry for the XC7A35T-2FTG256C to receive pricing and availability information tailored to your volume and delivery needs.

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