XC7A35T-3FGG484E

The XC7A35T-3FGG484E is an AMD Artix-7 Field Programmable Gate Array (FPGA) supplied in a 484-BBGA package. It combines a mid-range logic capacity with embedded memory and a substantial I/O count to support a wide range of digital integration tasks.

With 2,600 configurable logic blocks (CLBs) delivering 33,280 logic elements and approximately 1.84 Mbits of on-chip RAM, this surface-mount device is suited to designs that require moderate logic density, flexible I/O, and low-voltage core operation in an extended temperature grade.

Key Features

• Core Logic  2,600 CLBs providing 33,280 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 1.84 Mbits of on-chip RAM for data buffering, FIFOs, and small on-chip storage needs.
• I/O Capacity  250 user I/Os to support multiple parallel interfaces, peripheral connections, and board-level integration.
• Power and Supply  Core voltage operating range of 950 mV to 1.05 V to match targeted low-voltage system designs.
• Package & Mounting  484-ball BGA package (484-FBGA, 23×23 footprint) specified for surface-mount assembly and compact board layouts.
• Temperature & Grade  Extended grade with an operating temperature range from 0 °C to 100 °C for deployment in constrained thermal environments.
• RoHS Compliance  Environmentally compliant construction suitable for assemblies that require RoHS-status components.

Typical Applications

• Interface Bridging and Protocol Conversion  Use the 250 I/Os and programmable logic capacity to implement custom interface translators and protocol bridges on mid-density systems.
• Embedded Control and Signal Processing  Implement control state machines, data paths, and modest signal-processing blocks using the available logic elements and on-chip RAM for temporary storage.
• Prototyping and Development Platforms  Suitable for development boards and proof-of-concept systems that require reconfigurable hardware and moderate resource counts.
• Custom Peripheral Aggregation  Aggregate multiple sensors, peripherals, or communication endpoints where flexible I/O mapping and logic customization are required.

Unique Advantages

• Scalable Logic Capacity: 2,600 CLBs and 33,280 logic elements provide a balance of capacity for mid-range designs without oversizing the solution.
• Integrated Embedded Memory: Approximately 1.84 Mbits of on-chip RAM reduces reliance on external memory for buffering and small data structures.
• High I/O Count: 250 I/Os enable complex board-level connectivity and multiple parallel interfaces from a single device.
• Compact BGA Packaging: 484-BBGA (23×23) package supports dense board layouts while maintaining a standardized footprint for surface-mount assembly.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to accommodate designs that require expanded thermal range within the specified limits.
• Low-Voltage Core Operation: Core supply range of 950 mV to 1.05 V aligns with low-voltage system architectures and power-optimized designs.

Why Choose XC7A35T-3FGG484E?

The XC7A35T-3FGG484E positions itself as a mid-range, flexible FPGA option that brings together a meaningful balance of logic resources, embedded memory, and a high I/O count in a compact 484-BBGA package. Its extended temperature grade and low-voltage core make it a suitable choice for engineers targeting robust, reprogrammable hardware for control, interface, and prototyping applications.

Engineers and procurement teams will find long-term value in the device’s combination of scalable logic capacity and on-chip memory, enabling design iteration and system consolidation while reducing external component count. Backed by AMD’s Artix-7 product family documentation, the XC7A35T-3FGG484E fits designs that require predictable on-chip resources and flexible I/O mapping.

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